Semiconductor LED Display Driver Segmentation for Circular Bezel Design
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Solution Overview
Problem
Current display technologies, such as LCDs and AMOLEDs, face challenges including slow response time, limited flexibility, short lifespan, and difficulty in implementing circular displays with narrow bezels due to complex wiring connections between display panels and driver ICs.
Innovation Solution
A display device utilizing semiconductor light-emitting diodes with a configuration of parallel scan lines and intersecting data lines connected to drivers, allowing for flexible and circular display designs, and employing a conductive adhesive layer for electrical connections across level differences, enabling efficient signal transmission and reducing bezel size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If circular display is implemented using semiconductor light-emitting diodes, then display flexibility and shape adaptability are improved, but wiring connection complexity between display panel and driver IC increases
Solution Approach 1:
The patent divides the driver functionality into multiple driver ICs (first driver IC and second driver IC) that are distributed around the circular display perimeter. Each driver IC connects to a specific segment of the display, breaking the complex full-perimeter wiring into manageable segments. This segmentation reduces the wiring complexity for each individual connection while maintaining overall circular display functionality.
Solution Approach 2:
The patent transitions from traditional planar wiring connections to a three-dimensional arrangement where driver ICs are positioned around the circular perimeter and connect to the display through vertical vias and conductive layers. This dimensional change allows wiring to route around the circular shape rather than across it, reducing interference and simplifying connection paths.
2Area of stationary object
If narrow bezel design is implemented, then display area is increased, but wiring connection space between display panel and driver IC is reduced
Solution Approach 1:
The patent utilizes vertical wiring layers and vias to route signals through the thickness of the display structure, allowing connections to be made in the vertical dimension rather than consuming horizontal bezel space. This enables narrow bezel design while maintaining adequate wiring connection space through three-dimensional routing.
Solution Approach 2:
The patent employs thin-film conductive layers and flexible wiring structures that can be routed through the display thickness, allowing connections to be made without requiring large horizontal space. This enables the display to achieve a narrow bezel while still providing sufficient space for wiring connections through vertical and lateral routing within the thin-film structure.
3Ease of manufacture
If multiple driver ICs are used to reduce wiring complexity, then device structure becomes more complex, but manufacturing ease is improved
Solution Approach 1:
The patent segments the driver functionality into multiple smaller driver ICs that can be manufactured using standard fabrication processes and then separately mounted around the circular display. This segmentation makes each individual driver IC simpler to manufacture while the overall system achieves the desired circular display functionality through the coordinated arrangement of these simpler components.
Data Source
AI summary
A display device including semiconductor light-emitting diodes; a plurality of scan lines configured to transmit a scan driving signal to the semiconductor light-emitting diodes and located parallel to each other; a plurality of data lines intersecting the scan lines and configured to transmit a data driving signal to the semiconductor light-emitting diodes; and a first driver and a second driver connected to the scan lines and the data lines and configured to provide the scan driving signal and the data driving signal. Further, the data lines are split into a first data group of data lines connected to the first driver and a second data group of data lines connected to the second driver.