Semiconductor Light Emitting Device Display with Solderable Metal Ribs
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Solution Overview
Problem
Current display apparatuses using semiconductor light emitting devices face challenges in transferring and attaching these devices to wiring substrates, particularly for large areas, due to high difficulty and cost, and instability issues.
Innovation Solution
A display apparatus structure is proposed where semiconductor light emitting devices are disposed between ribs on a substrate, with solderable metal filled between the ribs to connect them to the wiring, allowing for easier electrical connection and attachment, and a phosphor layer is used to convert light wavelengths, eliminating the need for anisotropic conductive films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to connect semiconductor light emitting devices to wiring substrates, then electrical connection can be achieved, but the process becomes highly difficult and costly for large areas
Solution Approach 1:
The patent introduces a solderable metal layer as an intermediary between the semiconductor light emitting device and the wiring substrate. This metal layer simplifies the connection process by providing a dedicated bonding interface that facilitates easier attachment and electrical connection, particularly for large-area displays where direct connection would be highly complex and costly.
Solution Approach 2:
The connection structure is segmented into distinct functional layers: the semiconductor light emitting device, the solderable metal layer, and the wiring substrate. This segmentation allows each component to be optimized independently and simplifies the overall manufacturing process by enabling modular assembly, especially beneficial for large-area implementations.
2Area of stationary object
If conventional attachment methods are used for large area displays, then coverage can be achieved, but stability and reliability deteriorate
Solution Approach 1:
The patent changes the material parameter of the connection layer by introducing a solderable metal with specific bonding characteristics. This parameter change enables reliable attachment over large areas by providing consistent thermal and mechanical bonding properties across the entire display area, rather than relying on conventional methods that deteriorate in stability for large-scale implementations.
3Ease of manufacture
If anisotropic conductive films are used for electrical connection, then connection can be established, but costs increase and phosphor distribution becomes unstable
Solution Approach 1:
The patent extracts and eliminates the anisotropic conductive film from the structure, replacing it with a solderable metal layer. This removal resolves the issues of increased cost and phosphor distribution instability while maintaining electrical connection functionality through the alternative metal-based bonding approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the wiring process, reduces costs, and enhances stability during large-area attachment, while also securing the phosphor distribution for color conversion between devices, improving the overall efficiency and reliability of the display apparatus.
Implementation Method 1
a phosphor layer formed to cover the planarizing layer and the semiconductor light emitting devices to convert the wavelength of light
Data Source
AI summary
Discussed is a display apparatus and, more particularly, to a display apparatus using a semiconductor light emitting device. A display apparatus includes a substrate having a first wiring; a rib portion provided with a first rib and a second rib formed to protrude from one surface of the substrate, the first and second ribs disposed on opposite sides of the first wiring; a solderable metal filled between the first rib and the second rib, and formed to cover the first wiring; and a plurality of semiconductor light emitting devices sequentially arranged along the rib portion, at least part of the plurality of semiconductor light emitting devices are inserted into the solderable metal to be electrically connected to the first wiring.