Semiconductor Light Emitting Display with Flexible Wiring Substrate

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Solution Overview

Problem

Current display technologies, such as LCDs and AMOLEDs, face issues like mediocre response time, short lifespan, and limited flexibility, which semiconductor light emitting devices aim to address by implementing a flexible display device with semiconductor light emitting devices as sub-pixels and innovative connecting line structures.

Innovation Solution

A display device featuring a wiring substrate with conductive adhesive layers and semiconductor light emitting devices electrically connected to electrodes, utilizing connecting lines that allow for flexibility and reduced area, enabling a rollable and high-definition display.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If LCDs are used for display, then image display capability is achieved, but response time is mediocre and flexibility is difficult to implement

Engineering Contradiction:
Improveresponse timeVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the fundamental material parameter from liquid crystal to semiconductor light emitting devices, enabling both fast response time (intrinsic property of LEDs) and flexibility (through flexible substrate integration). This parameter change resolves the contradiction by selecting a different technology class that inherently possesses both desired properties.

Inventive Principle:
Principle #35Parameter changes

2Duration of action of stationary object

If AMOLEDs are used for display, then image display capability is achieved, but lifespan is short and flexibility is limited

Engineering Contradiction:
ImprovelifespanVSAvoidflexibility
Core Design Contradiction:
Duration of action of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent transitions from organic OLED materials to inorganic semiconductor light emitting devices, fundamentally changing the material composition parameter. This enables extended lifespan (semiconductors have longer operational life than organic materials) while achieving flexibility through integration on flexible substrates, thus resolving the contradiction between lifespan and flexibility.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional connecting lines are used, then electrical connection is achieved, but device area is large and flexibility is reduced

Engineering Contradiction:
Improveelectrical connectionVSAvoiddevice area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent moves connecting lines from a two-dimensional planar layout to a three-dimensional stacked configuration. Connecting lines are arranged in multiple layers at different heights, allowing electrical connections to pass through the vertical dimension. This dimensional transition reduces the horizontal area occupied by connecting lines while maintaining reliable electrical connectivity, thus resolving the contradiction between connection reliability and area minimization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested connecting line structures where connecting lines are embedded within multi-layer substrate stacks. The connecting lines are positioned inside the vertical stack of substrate layers, nesting the electrical connection path within the device's three-dimensional structure. This nesting approach minimizes the external footprint while ensuring robust electrical connections.

Inventive Principle:
Principle #7Nested doll (Nesting)

4Adaptability or versatility

If flexible display is implemented, then adaptability is improved, but manufacturing complexity increases

Engineering Contradiction:
ImproveflexibilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent divides the display device into modular segments: flexible substrate layer, semiconductor light emitting device layer, and connecting line layer. Each segment can be manufactured and tested independently before assembly. This segmentation reduces manufacturing complexity by breaking down the complex flexible display fabrication into manageable, standardized processes while preserving the overall flexibility of the device.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a flexible, high-definition display with improved response time and lifespan by using semiconductor light emitting devices and optimized connecting line structures, enhancing the display's flexibility and reducing the bezel size.

Implementation Method 1

light emitting diodes (LEDs) are well known light emitting devices for converting an electrical current to light

Methodology Applied
Scientific EffectLight emitting diode (LED) effect: Light Emitting Diode

Implementation Method 2

a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9082947B2Display device using semiconductor light emitting device
Publication Date: 2015.07.14 LG ELECTRONICS INC
  • US9082947B2 patent drawing
  • US9082947B2 patent drawing
  • US9082947B2 patent drawing

AI summary

Discussed is a display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to a first electrode and a second electrode, wherein the first electrode is disposed at the first substrate layer, and the second substrate layer includes one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.