Semiconductor Light Emitting Device Package With Integrated Sensors
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Solution Overview
Problem
Conventional semiconductor light emitting device packages face challenges in adjusting heat and light output due to variations in thermal emission and light emission among devices, requiring temperature and light measurement for environmental adaptation.
Innovation Solution
Incorporating a thermo sensor and photo sensor within the package body, with a thermo sensor using nickel for heat sensing and titanium for heat transfer, and a photo sensor with polycrystalline silicon and silicon nitride films, to measure and adjust heat and light output effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If semiconductor light emitting devices are used to emit light of various colors with high efficiency, then low power consumption and semi-permanent lifespan are achieved, but heat emission occurs which may have negative effects on device driving
Solution Approach 1:
A thermo sensor is introduced as an intermediary component to detect the temperature of the semiconductor light emitting device. The thermo sensor includes a heat sensing portion, an electrode pad, and a heat transfer portion that transfers heat from the semiconductor device to the sensing portion, enabling temperature monitoring without directly interfering with the light emitting function.
Solution Approach 2:
The patent implements a feedback mechanism where the thermo sensor continuously monitors the temperature of the semiconductor light emitting device and provides this information to a control circuit. Based on the temperature feedback, the control circuit adjusts the driving current or voltage to prevent overheating and maintain optimal operating conditions.
2Manufacturing precision
If semiconductor light emitting devices are fabricated according to the same specifications, then consistent performance is expected, but variations in thermal emission and light emission occur
Solution Approach 1:
The package equips itself with sensing capabilities by integrating both thermo sensor and photo sensor components directly into the package structure. These sensors automatically monitor temperature and light output, enabling the system to self-adjust and compensate for manufacturing variations without requiring external calibration or adjustment mechanisms.
Solution Approach 2:
The patent utilizes parameter changes in the sensing components' responses to detect variations in temperature and light output. By monitoring changes in electrical parameters (such as resistance changes in the thermo sensor or current changes in the photo sensor), the system can detect and compensate for manufacturing variations in the semiconductor light emitting devices.
3Adaptability or versatility
If temperature adjustment is necessary according to external environment, then device performance is optimized, but additional measurement and control mechanisms are required
Solution Approach 1:
The patent merges multiple functions into integrated sensor components. The thermo sensor combines heat transfer portion, heat sensing portion, and electrode pad into a single integrated structure. Similarly, the photo sensor integrates light detection functionality with the package body, reducing the need for separate measurement and control mechanisms while maintaining environmental adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise adjustment of heat and light output, improving the performance and adaptability of semiconductor light emitting device packages to environmental conditions.
Implementation Method 1
a thermo sensor placed on the raised portion of the package body with the insulating layer interposed between the thermo sensor and the package body
Implementation Method 2
The semiconductor light emitting device emits heat as well as the above-described first wavelength range of light
Implementation Method 3
a photo sensor placed on the raised portion of the package body and configured to measure output of the semiconductor light emitting device
Implementation Method 4
The fluorescent substance 150 is excited by a first wavelength range of light emitted from the semiconductor light emitting device 10, thereby emitting a second wavelength range of light
Data Source
Figure 1~2
Figure 3a
Figure 3b
AI summary
Embodiments provide a light emitting device package including a package body having a top-opened cavity disposed in at least a portion thereof, a first electrode layer and a second electrode layer electrically isolated from the package body with an insulating layer interposed therebetween, the first electrode layer and the second electrode layer being electrically isolated from each other at a bottom surface of the cavity, a light emitting device placed on the bottom surface of the cavity configured to emit light through the open region of the cavity, and a sensor placed on at least a portion of the package body at the outside of the cavity configured to measure output of the light emitting device.