Semiconductor Light Emitting Device Raised Plane Resin Leakage
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Solution Overview
Problem
Conventional semiconductor light emitting devices experience resin leakage during the molding process due to gaps between the base and molds, leading to incomplete sealing and the formation of resin burrs, which can disrupt the conduction path to external circuits.
Innovation Solution
A semiconductor light emitting device with a support member featuring a raised plane that extends from one edge to the other edge of the mold pressing region, ensuring the support member is in close contact with the mold, preventing gaps and resin leakage by acting as a barrier during the molding of the sealing resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the base is sandwiched between molds for sealing resin formation, then the semiconductor light emitting element is protected, but gaps between the molds and base cause resin leakage
Solution Approach 1:
The patent applies preliminary action by forming a resin layer on the base before the molding process. This pre-formed layer fills potential gaps between the base and molds, preventing resin leakage during injection. The resin layer is applied in advance to the areas where gaps might occur, ensuring that when the sealing resin is injected, it cannot leak through the pre-sealed gaps.
Solution Approach 2:
The patent uses an intermediary approach by introducing a resist layer as a mediator between the base and the sealing resin. This resist layer acts as a barrier that prevents direct contact between the sealing resin and the base in areas where gaps might form, thereby preventing resin leakage while still allowing the sealing resin to properly encapsulate the semiconductor element.
2Reliability
If resin leakage occurs during molding, then the conduction path to external circuits is disrupted, but adding measures to prevent leakage increases process complexity
Solution Approach 1:
The patent prevents conduction path disruption by taking preliminary action - forming a protective resin layer on the base before injecting the sealing resin. This pre-formed layer ensures that even if gaps exist between molds and base, the resin cannot leak onto the conduction paths. By addressing the prevention issue in advance rather than dealing with repairs afterward, the process remains simple while ensuring conduction path integrity.
3Manufacturing precision
If gaps exist between base and molds, then resin leakage occurs, but eliminating gaps requires precise positioning that increases manufacturing difficulty
Solution Approach 1:
The patent uses an intermediary resin layer that is applied to the base before molding. This intermediary layer compensates for positioning imprecisions and gaps between the base and molds. Instead of requiring extremely precise positioning to eliminate gaps, the resin layer fills these gaps, allowing manufacturing with standard positioning tolerances while still preventing resin leakage.
Solution Approach 2:
The patent changes the parameter approach by shifting from controlling gap dimensions (positioning precision) to controlling the presence and properties of the pre-formed resin layer. Rather than demanding sub-micron positioning precision to eliminate gaps, the process parameters focus on applying a sufficient resin layer that will fill any gaps that do exist, making the process more tolerant of normal manufacturing variations.
Data Source
AI summary
A semiconductor light emitting device includes: a semiconductor light emitting element; a sealing resin covering the light emitting element; and a support member including a base and supporting the light emitting element and the sealing resin, the base including a base main surface facing one side of first direction, a base back surface facing the other side of the first direction, a pair of first base side surfaces opposite each other in second direction orthogonal to the first direction, and a pair of second base side surfaces opposite each other in third direction orthogonal to the first and second directions, wherein the support member includes a raised plane raised from the base main surface in the first direction, and wherein the plane is exposed from the sealing resin and includes a portion extending from one edge to the other edge in the third direction when viewed in the first direction.