Semiconductor Light Emitting Device Series Connection Heat Dissipation
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Solution Overview
Problem
Semiconductor light emitting devices face challenges in heat dissipation and miniaturization due to the need for electrical isolation of LEDs, which inhibits the use of substrates for heat dissipation and increases the size of the device.
Innovation Solution
The semiconductor light emitting device design includes a conductive substrate with light emitting bodies connected in series, where one end is connected to the substrate and the other end to a bonding pad, reducing the number of bonding pads on the chip surface and allowing for efficient heat dissipation through the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple LEDs are electrically isolated from the substrate to enable series connection, then reliability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The substrate surface is segmented into multiple regions, with insulating films selectively formed only in specific areas between adjacent LEDs. This partial segmentation approach maintains electrical isolation for series connection while leaving other areas open for heat dissipation, resolving the contradiction between reliability improvement and heat dissipation capability.
2Reliability
If bonding pads are disposed on the substrate for series connection, then electrical isolation is achieved, but device size increases
Solution Approach 1:
The electrical isolation function is moved from the planar dimension (bonding pads on substrate surface) to the vertical dimension (insulating films formed between adjacent LEDs). This dimensional transition eliminates the need for additional bonding pad area, achieving electrical isolation without increasing device footprint.
3Reliability
If bonding pads are disposed on the substrate for series connection, then electrical isolation is achieved, but heat dissipation through substrate is inhibited
Solution Approach 1:
The substrate surface is segmented into multiple regions, with insulating films selectively formed only in specific areas between adjacent LEDs. This partial segmentation approach maintains electrical isolation for series connection while leaving other areas open for heat dissipation, resolving the contradiction between reliability improvement and heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and allows for a smaller device size while maintaining uniform luminance and high reliability by reducing the area occupied by bonding pads and improving current distribution across the light emitting bodies.
Implementation Method 1
This may inhibit the heat dissipation through the substrate
Data Source
AI summary
A semiconductor light emitting device includes first and second light emitting bodies, a first electrode, a second electrode and a first interconnection. The first and second light emitting bodies are disposed on a conductive substrate, and each includes first and second semiconductor layers and a light emitting layer therebetween. The first electrode is provided between the first light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer and the conductive substrate. The second electrode is provided between the second light emitting body and the conductive substrate, and electrically connected to a first semiconductor layer. The first interconnection electrically connects the second semiconductor layer of the first light emitting body and the second electrode. The first interconnection includes a first portion extending over the first and second light emitting bodies and a second portion extending into the second light emitting body.