Semiconductor Light Emitting Device with Truncated Cone Reflectors
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Solution Overview
Problem
Conventional semiconductor light emitting devices face reduced brightness due to light blockage by wires and suboptimal light reflection efficiency caused by the shape and size of reflectors, which are determined to accommodate wire bonding.
Innovation Solution
The semiconductor light emitting device features truncated cone reflectors surrounding each LED chip, with wires connected outside the reflector space, allowing for improved light reflection and the use of heat dissipaters to enhance output, and includes a resin for wavelength conversion and a transparent resin with lenses for efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are arranged inside the space surrounded by the reflector to bond with the wiring pattern, then electrical connection is achieved, but light blockage increases and brightness decreases
Solution Approach 1:
The wire bonding location is extracted from the reflector space and moved to the outer peripheral region. The wire is bonded to the wiring pattern at a position outside the reflector space, thereby removing the light-blocking element from the optical path while maintaining electrical connection functionality.
2Ease of manufacture
If the reflector space is enlarged to accommodate wire bonding, then wire connection is possible, but light reflection efficiency decreases
Solution Approach 1:
The wire bonding function is extracted from the reflector space, allowing the reflector to maintain its optimal shape and size for light reflection without needing to accommodate wire connections within its boundaries.
Solution Approach 2:
The wire bonding location is shifted from the vertical space within the reflector to the horizontal outer peripheral region, utilizing a different spatial dimension to resolve the conflict between wire connection needs and light reflection efficiency.
3Illumination intensity
If wires are positioned outside the reflector space, then light blockage is reduced and brightness increases, but wire bonding becomes more complex
Solution Approach 1:
The device structure is segmented into distinct functional zones: the reflector space dedicated to light reflection and the outer peripheral region dedicated to wire bonding. This spatial segmentation allows each component to optimize its function without interfering with the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases brightness by minimizing light blockage and optimizing light reflection, while effective heat dissipation and uniform wavelength conversion enhance the device's output and efficiency.
Implementation Method 1
Each of the reflectors has a high reflectivity... the light reflection efficiency of the reflector
Implementation Method 2
The fluorescent resin members 94 fill the spaces surrounded by the reflectors 91a
Implementation Method 3
at least one heat dissipater provided with a first surface on which the semiconductor light emitting elements are mounted
Data Source
AI summary
A semiconductor light emitting device (A1) includes a case (1) and a plurality of semiconductor light emitting elements (3) arranged in the case. The case (1) is formed with a plurality of reflectors (11) each in the form of a truncated cone surrounding a respective one of the semiconductor light emitting elements (3). Current is applied to each of the semiconductor light emitting elements (3) via two wires (6). Each of the wires (6) includes a first end, and a second end opposite to the first end. The first end is connected to the semiconductor light emitting element (3), whereas the second end is located outside the space surrounded by the reflector (11).