Semiconductor Light Emitting Device Uneven Electrode Structure
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Solution Overview
Problem
Conventional semiconductor light emitting devices face challenges in enhancing external quantum efficiency and adhesive strength between semiconductor layers, particularly due to the flatness of electrode layers which limits light extraction and reliability.
Innovation Solution
The introduction of a discontinuous first semiconductor layer with an uneven structure and a second electrode layer having a corresponding uneven shape, along with a conductive support member, enhances light reflection and extraction by altering the critical angle of incident light, thereby improving external quantum efficiency and adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat second electrode layer is used, then the manufacturing process is simple, but the external quantum efficiency is low due to limited light extraction
Solution Approach 1:
The second electrode layer is formed with an uneven surface having protrusions and recesses instead of a flat surface. This curved/uneven structure increases the critical angle for light extraction, allowing more light to escape from the semiconductor layer, thereby improving external quantum efficiency while maintaining manufacturing feasibility through standard deposition techniques
Solution Approach 2:
The surface morphology parameter of the second electrode layer is changed from flat to uneven by controlling deposition conditions or using self-assembly processes. This parameter change increases light extraction efficiency by creating multiple interfaces with different critical angles, resolving the contradiction between manufacturing simplicity and device performance
2Device complexity
If a flat second electrode layer is used, then the structure is simple, but the adhesive strength between electrode and semiconductor layer is insufficient
Solution Approach 1:
The uneven surface structure of the second electrode layer creates increased surface area and mechanical interlocking features (protrusions and recesses) that enhance adhesive bonding between the electrode and the underlying semiconductor layer, thereby improving strength without significantly increasing structural complexity
Solution Approach 2:
The second electrode layer exhibits local variations in surface topology with protrusions and recesses distributed across the layer. These local structural differences create multiple bonding interfaces and increase contact area with the semiconductor layer, enhancing overall adhesive strength while maintaining overall structural simplicity
3Device complexity
If the critical angle for light extraction is not optimized, then the device structure remains conventional, but light extraction efficiency is limited
Solution Approach 1:
The uneven surface structure of the second electrode layer creates multiple critical angles for light extraction across different regions of the surface. Light rays incident at various angles can find extraction paths through the protrusions and recesses, reducing total internal reflection losses and improving overall light extraction efficiency without requiring complex additional structures
Solution Approach 2:
The natural tendency of light to undergo total internal reflection at flat interfaces (which causes energy loss) is converted into a benefit by introducing an uneven surface structure. The same optical principles that cause reflection at flat surfaces are exploited through curved/uneven interfaces to create extraction pathways, turning the harmful reflection effect into useful light extraction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases external quantum efficiency and electrical reliability by optimizing light extraction and adhesive properties, making the semiconductor light emitting device more effective as a light source in various applications.
Implementation Method 1
enhances light reflection and extraction by altering the critical angle of incident light
Data Source
AI summary
Provided are a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises a first electrode on an region of top surface of a first conductive semiconductor layer; a second electrode layer under a second conductive semiconductor layer; and a conductive support member under the second electrode layer, wherein the second conductive semiconductor layer includes a plurality of recesses on a lower portion of the second conductive semiconductor layer, wherein the second electrode layer has an uneven structure corresponding to the plurality of recesses.


