Semiconductor Light-Emitting Lens Alignment Using Light-Blocking Patterns
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Solution Overview
Problem
Existing methods for aligning the current injection region and lens in semiconductor light-emitting devices, such as VCSELs, face challenges due to misalignment caused by differences in refractive indices, leading to increased threshold values and reduced yield, and require costly exposure devices with complex alignment processes.
Innovation Solution
A method involving a light-blocking structure on the substrate surface is used to pattern a photosensitive layer, allowing for precise alignment of the lens and current injection region without the need for a photomask, thereby eliminating misalignment issues and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment marks are overlapped through the substrate to align the current injection region and photomask, then alignment can be performed, but misalignment occurs due to refractive index difference between substrate and air
Solution Approach 1:
The patent creates a virtual image of the alignment mark on the front surface by reflecting light from the back surface alignment mark through the substrate. This virtual image serves as a reference that accounts for refractive index effects, allowing accurate alignment without direct through-substrate measurement. The copying approach transfers the alignment reference to a location where it can be used without suffering from refractive index distortion.
2Ease of manufacture
If exposure is performed through the substrate to pattern the photosensitive member, then lens formation is achieved, but measurement errors increase and development delays occur
Solution Approach 1:
The patent introduces a light-blocking structure as an intermediary element that enables alignment verification without requiring through-substrate measurement. The light-blocking structure is positioned on the front surface and blocks light in the exposure process, creating a visible pattern that confirms proper alignment between the current injection region and the photosensitive member pattern. This intermediary approach allows measurement and verification to be performed on the front surface rather than through the substrate.
3Manufacturing precision
If expensive exposure devices with improved alignment accuracy are used, then alignment precision increases, but production cost increases significantly
Solution Approach 1:
The patent employs alignment marks and light-blocking structures that are formed as part of the standard fabrication process on the substrate itself. These features serve dual purposes: they are functional elements of the device and simultaneously provide alignment references. This self-service approach eliminates the need for specialized external alignment tools or expensive measurement equipment, as the substrate provides its own alignment infrastructure through the integrated marks and blocking structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-accuracy alignment, improves electrical and optical properties, and enhances yield by simplifying the alignment process and reducing the need for expensive exposure devices.
Implementation Method 1
a light-blocking structure on the substrate surface is used to pattern a photosensitive layer
Implementation Method 2
this pattern of the photosensitive member is used to form a lens
Data Source
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AI summary
[Object] To provide a semiconductor light-emitting device that has excellent productivity and is capable of aligning a current injection region and a lens with high accuracy, and a method of producing the semiconductor light-emitting device. [Solving Means] A method of producing a light-emitting device according to the present technology includes: forming a light-blocking structure that is a structure opaque to an exposure wavelength on a side of a first main surface of a substrate having the first main surface and a second main surface on a side opposite to the first main surface; forming a photosensitive layer that is formed of a photosensitive material on a side of the second main surface of the substrate; applying light having the exposure wavelength to the substrate from the side of the first main surface and forming the photosensitive layer into a pattern corresponding to the light-blocking structure; and forming a lens using the photosensitive layer.