Semiconductor Lid Bonding via Inlet Resin Injection
Solution Overview
Problem
The existing semiconductor package designs, such as FCBGA, face challenges in miniaturization due to the requirement of a large edge portion for superior adhesive strength between the lid and the wiring board, which restricts the reduction of package size and increases stress on the semiconductor chip.
Innovation Solution
Incorporating inlet portions in the lid for injecting gap filling resin to bond the lid and wiring board internally, allowing for improved adhesive strength without the need for a large edge portion, and using a dispenser to inject and thermally cure the resin, thereby reducing package size and stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the edge portion of the lid is used to bond the lid and wiring board, then adhesive strength is improved, but package size cannot be miniaturized
Solution Approach 1:
The patent transitions from bonding at the edge portion (one-dimensional line contact) to bonding at the bottom surface (two-dimensional area contact). This dimensional change allows the resin to be injected and cured within the lid to form adhesive portions that cover a larger area, achieving superior adhesive strength without requiring a large edge portion, thus enabling package miniaturization.
Solution Approach 2:
The patent extracts the bonding function from the edge portion structure and relocates it to the bottom surface through injected resin. By separating the bonding function from the structural edge portion, the design allows the edge portion to be minimized while the bonding function is achieved through the resin adhesive portions formed at the bottom surface.
2Reliability
If the edge portion size is increased for superior adhesive strength, then bonding reliability is improved, but stress on the semiconductor chip increases
Solution Approach 1:
By moving the bonding area from the edge (linear) to the bottom surface (area), the stress is distributed over a larger area, reducing the stress concentration on the semiconductor chip while maintaining or improving bonding reliability.
Solution Approach 2:
The resin is injected to form adhesive portions specifically at the bottom surface where bonding is needed, creating local adhesive strength without requiring a large overall edge portion. This localized bonding approach reduces stress on the chip while ensuring reliable attachment where required.
3Strength
If a large edge portion is used for bonding, then adhesive strength is improved, but manufacturing complexity increases
Solution Approach 1:
The lid structure includes inlet portions that enable self-service resin injection. The resin is injected through these inlet portions and automatically fills the space to form adhesive portions at the bottom surface, eliminating the need for complex external bonding processes and large edge portions.
Solution Approach 2:
The inlet portions are pre-formed in the lid structure, allowing resin to be injected and adhesive portions to be formed before final assembly. This preliminary action simplifies the manufacturing process by preparing the bonding material in advance, reducing the need for complex subsequent bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables miniaturization of semiconductor packages while maintaining strong adhesive bonds between the lid and wiring board, reducing warpage and improving thermal radiation performance, and enhancing the reliability of the semiconductor package.
Implementation Method 1
thermally-curing the gap filling resin
Data Source
AI summary
A semiconductor apparatus includes: a wiring board; a lid; and gap filling resin. A semiconductor chip is mounted on the wiring board. The lid includes inlet portions for injecting resin. The semiconductor chip is covered with the lid on the wiring board. The gap filling resin bonds the wiring board and the lid inside the lid.