Semiconductor Package Lid with Capillary Holes for Void Control

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Solution Overview

Problem

Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.

Innovation Solution

The proposed semiconductor devices incorporate a substrate with a conductive structure, an electronic component coupled with a metallization layer, and a lid with capillary holes, utilizing a thermal interface material to enhance thermal management and reduce void formation, along with a stiffener for structural support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing is simpler, but reliability decreases and cost increases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The package structure is segmented into distinct functional layers: substrate, electronic component, lid, and stiffener. Each layer performs a specific function (support, electrical connection, thermal management, structural reinforcement), allowing optimization of each component independently while improving overall reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package employs composite material structures combining different materials with complementary properties: conductive materials for electrical connections, thermally conductive materials for heat dissipation, and mechanically strong materials for structural support, thereby enhancing reliability without excessive complexity

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If conventional packaging is used, then manufacturing is easier, but package size becomes too large

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing ease

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The package design transitions from planar expansion to vertical stacking, arranging substrate, electronic component, lid, and stiffener in overlapping vertical layers. This dimensional change reduces the horizontal footprint while maintaining all necessary functional elements, achieving compact size without sacrificing manufacturing feasibility

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If thermal management is enhanced with additional materials, then thermal dissipation improves, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal dissipationVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The lid structure serves multiple functions simultaneously: it provides mechanical protection, enables thermal dissipation through integrated heat dissipation structures, and facilitates void reduction through capillary hole design. This multi-functionality improves thermal management without requiring separate dedicated components, thereby avoiding excessive manufacturing complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Reliability

If void formation is reduced through structural modifications, then reliability improves, but device complexity increases

Engineering Contradiction:

Improvevoid formation controlVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The lid incorporates capillary holes (porous structure) that actively draw out excess thermal interface material during assembly, preventing void formation. This porous design feature is integrated into the lid manufacturing process and provides automatic void prevention through capillary action, improving reliability without requiring complex external processes

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves thermal dissipation, reduces void formation, and enhances structural integrity, resulting in more reliable and compact semiconductor packages.

Implementation Method 1

a thermal interface material between the first electronic component and the lid

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a lid with capillary holes, utilizing a thermal interface material to enhance thermal management and reduce void formation

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS12532741B2Semiconductor devices and methods of manufacturing semiconductor devices

Publication Date: 2026.01.20 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.