Two-Part Semiconductor Lid for Direct-Die Cooling and Warpage Control
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in effectively managing heat dissipation, leading to thermal performance limitations that can cause chip failure and damage, especially in high-power devices, due to inadequate heat dissipation capabilities.
Innovation Solution
A lidded semiconductor package design featuring a two-part lid with an annular lid base and a cover plate, where the cover plate includes a central heat slug and an outwardly protruding flange, allowing for direct contact with the semiconductor die without thermal interface materials, and can be replaced with a forced cooling module for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thermal interface material is used between the lid and semiconductor die, then the assembly is easier to manufacture, but the thermal performance deteriorates due to additional thermal resistance
Solution Approach 1:
The patent removes the thermal interface material layer from the heat dissipation path by implementing direct metal-to-die contact through the lid structure. The lid base is configured to directly contact the semiconductor die surface, eliminating the thermal resistance introduced by TIM layers while maintaining assembly feasibility through precision manufacturing and direct bonding techniques.
Solution Approach 2:
The lid base acts as an intermediary structure that provides both mechanical support and direct thermal conduction path. By designing the lid base with specific geometric features and material properties, it serves as a mediator that enables direct thermal contact between the heat sink and semiconductor die without requiring additional thermal interface materials.
2Device complexity
If a traditional single-part lid is used, then the manufacturing process is simpler, but the thermal management capability is insufficient for high-power devices
Solution Approach 1:
The lid is segmented into multiple functional components: a lid base that directly contacts the semiconductor die for optimal thermal conduction, and a lid cover that provides mechanical protection and houses additional thermal management features. This segmentation allows each component to be optimized for its specific function while maintaining overall manufacturing feasibility.
Solution Approach 2:
The lid structure is designed to perform multiple functions simultaneously: the lid base provides direct thermal conduction and mechanical support, while the lid cover provides protection and can accommodate additional thermal management features such as heat sinks or thermal vias. This multi-functionality enables effective heat dissipation without proportionally increasing device complexity.
3Temperature
If more thermal interface materials are used to improve thermal contact, then the thermal conduction improves, but the warpage control and SMT performance deteriorate
Solution Approach 1:
The patent eliminates thermal interface materials from the design, removing the source of warpage and SMT performance issues. By achieving direct metal-to-die contact through precision-engineered lid base geometry and material selection, the solution improves thermal conduction while avoiding the adverse effects of TIM layers on package flatness and solder joint quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves warpage control and thermal performance by allowing direct contact between the heat slug and the semiconductor die, reducing the need for thermal interface materials and enabling better heat dissipation, thus enhancing the reliability and performance of semiconductor packages.
Implementation Method 1
the cover plate comprises a central heat slug and an outwardly protruding flange integrally constructed with the central heat slug... allowing for direct contact with the semiconductor die without thermal interface materials
Data Source
AI summary
A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.