Semiconductor Lid Gas Sensor With Micro-Holes
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Solution Overview
Problem
Existing gas sensors lack effective waterproofing and high gas permeability, leading to inadequate response speed and mechanical strength, particularly when using metal or ceramic lids with large through-holes, which are costly and inefficient to manufacture.
Innovation Solution
A gas sensor design featuring a semiconductor lid with through-holes of 50 μm or less in diameter, formed using semiconductor processes, providing improved waterproofing (IPX4 or higher) and increased gas permeability, while maintaining mechanical strength through a thick substrate and high area ratio of through-holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If metal or ceramic lids with large through-holes are used, then gas permeability is improved, but waterproofing performance deteriorates
Solution Approach 1:
The patent changes the critical parameter of through-hole diameter from large (conventional) to small (50 μm or less), which fundamentally alters both gas permeability characteristics and waterproofing performance. This parameter change enables the lid to block water while maintaining gas passage capability
Solution Approach 2:
The patent employs a composite structure combining a semiconductor substrate with specific through-hole architecture. The semiconductor material properties combined with the controlled through-hole distribution create a lid that simultaneously achieves gas permeability and waterproofing functions that neither material alone could provide
2Reliability
If through-hole diameter is reduced to improve waterproofing, then gas permeability deteriorates
Solution Approach 1:
The patent divides the lid structure into multiple segments with numerous small through-holes distributed across the surface. This segmentation approach allows water to be blocked by individual small holes while collectively providing sufficient gas permeability through the aggregated effect of many holes
Solution Approach 2:
The patent optimizes the through-hole diameter parameter to 50 μm or less, which is the critical threshold that provides both waterproofing and adequate gas permeability. This precise parameter control resolves the trade-off between water blocking and gas passage
3Ease of manufacture
If semiconductor processes are used to form small through-holes, then manufacturing cost is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces conventional mechanical drilling or punching methods with semiconductor fabrication processes to form through-holes. This substitution enables precise control of through-hole diameter at 50 μm or less while reducing overall manufacturing cost through standardized semiconductor manufacturing techniques
Solution Approach 2:
The patent specifies a through-hole diameter parameter of 50 μm or less, which is optimally suited for semiconductor manufacturing processes. This parameter choice enables the use of cost-effective semiconductor fabrication methods while achieving the required precision for both waterproofing and gas permeability
Data Source
AI summary
A gas sensor includes: a gas detector; and a lid configured to cover the gas detector, wherein the lid is made of a semiconductor material, wherein the lid includes a first main surface facing the gas detector and a second main surface opposite the first main surface, wherein the lid is provided with a plurality of through-holes, each of the plurality of through-holes extending from the first main surface to the second main surface, and wherein each of the plurality of through-holes has a diameter of 50 μm or less.