Semiconductor Package Lid Structure for High-Power Heat Dissipation
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Solution Overview
Problem
The miniaturization of semiconductor devices is hindered by heat dissipation issues during operation, which can decrease the reliability and lifetime of the die due to prolonged exposure to excessive temperatures.
Innovation Solution
A semiconductor device structure is designed with a thermal conductive bonding layer, a lid, and additional features like pillars and trenches to enhance heat dissipation, including a backside metal layer and encapsulant to improve thermal conductivity and reduce contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the die operates at high power density, then the device performance is improved, but excessive heat is generated which decreases reliability and lifetime
Solution Approach 1:
The patent segments the heat dissipation function into multiple components: a first heat dissipation structure directly coupled to the die, a second heat dissipation structure coupled to the first, and a third heat dissipation structure coupled to the second. This segmentation allows heat to be dissipated through multiple pathways, improving heat transfer efficiency while maintaining device reliability during high power density operation.
Solution Approach 2:
The patent introduces intermediate heat dissipation structures that act as mediators between the heat source (die) and the external environment. These intermediate structures facilitate heat transfer through their lateral surfaces, providing an additional heat dissipation pathway that reduces the thermal load on the die, thereby maintaining reliability during high power operation.
2Volume of moving object
If miniaturization is pursued, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from traditional vertical heat dissipation to lateral heat dissipation by designing heat dissipation structures that extend in the lateral direction (first and second lateral directions). This dimensional change allows heat to be dissipated through the lateral surfaces of the heat dissipation structures, effectively increasing the heat dissipation area without increasing the overall device footprint, thus resolving the heat dissipation challenge in miniaturized devices.
3Temperature
If heat dissipation structures are added, then heat transfer is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with existing device components by coupling heat dissipation structures to the die and substrate through available interfaces. This integration approach allows heat dissipation functionality to be added without introducing entirely new separate components, thereby improving heat transfer while minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat generated by semiconductor dies, enhancing the reliability and longevity of the device by preventing coolant contact and optimizing heat transfer.
Implementation Method 1
a thermal conductive bonding layer disposed on the semiconductor package and adapted to reduce contact thermal resistance and improve heat dissipation
Implementation Method 2
a cover disposed on the substrate, wherein a space is defined between the cover and the lid, and a cooling fluid flows through the space
Data Source
AI summary
A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.