Semiconductor Lid With Thermal Inserts for Hot Spot Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power densities in semiconductor devices lead to local thermal hot spots, which can result in elevated temperatures, impacting reliability and performance, and existing heat dissipation methods struggle to manage these hot spots effectively, especially in compact semiconductor packages.
Innovation Solution
A semiconductor package lid with high thermal conductivity inserts made of materials like graphite, copper, or CVD diamond is used, which are positioned to directly address hot spots and bonded to the lid using a conductive material, ensuring optimal thermal interface contact and uniform bondline thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high power density semiconductor devices are used to improve performance, then system performance and circuit density are improved, but local thermal hot spots are generated that impact reliability and performance
Solution Approach 1:
The patent applies local quality by inserting high thermal conductivity material inserts (such as diamond, graphite, or metal) into specific regions of the lid corresponding to hot spot locations on the semiconductor device. These inserts are positioned to directly address localized thermal problems rather than uniformly treating the entire lid, allowing different regions of the lid to have different thermal conductivity properties tailored to the thermal profile of the underlying semiconductor device
Solution Approach 2:
The lid is constructed as a composite structure combining a base lid material with high thermal conductivity material inserts. This composite approach allows the lid to leverage the thermal management benefits of high conductivity materials in strategic locations while maintaining the structural and cost advantages of the base material in other regions, creating a hybrid structure optimized for thermal performance
2Volume of moving object
If the lid is made thinner to reduce package size, then package size is reduced, but thermal management capability is compromised
Solution Approach 1:
Rather than uniformly increasing lid thickness, the patent uses localized high thermal conductivity inserts within the lid structure. These inserts provide enhanced thermal pathways in specific regions without requiring the entire lid to be thicker, thus maintaining compact package dimensions while improving thermal management where needed
Solution Approach 2:
The composite lid structure combines thin base material with strategically placed high thermal conductivity inserts. This allows the lid to maintain overall thinness for compact packaging while the embedded high conductivity materials provide sufficient thermal management capability by creating efficient heat pathways from hot spot regions
3Temperature
If high thermal conductivity inserts are added to the lid to improve heat removal, then thermal performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The lid is segmented into regions with and without high thermal conductivity inserts, allowing the thermal management solution to be applied only where needed. This segmentation enables selective placement of inserts in regions corresponding to hot spots, reducing overall complexity compared to making the entire lid complex or using high conductivity material throughout
Solution Approach 2:
By applying high thermal conductivity inserts only in specific locations rather than uniformly throughout the lid, the patent minimizes the increase in device complexity. The localized approach allows the majority of the lid to remain simple while providing enhanced thermal performance only in the regions where it is most needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves thermal performance by maintaining a consistent thermal interface thickness and enhancing heat removal from hot spots, reducing temperatures by approximately 2°C compared to assemblies without inserts, and compensates for package warpage, ensuring reliable and efficient heat management.
Implementation Method 1
A lid for a semiconductor device package... comprising: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device... a plurality of inserts for filling the perforations, each of the inserts being made of a second material...
Data Source
AI summary
A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.