Semiconductor Package Lid Recess for Heat Dissipation and Warpage
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Solution Overview
Problem
Existing semiconductor packaging structures face challenges in providing adequate protection and heat dissipation, particularly due to warpage issues and thermal expansion mismatches between components, which can lead to reliability and performance problems.
Innovation Solution
A semiconductor package structure is developed with a lid having a recess to accommodate thermal interface material, reducing gaps and enhancing contact, and a molding layer to provide mechanical and thermal stability, along with an underfill layer for stronger connections and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor package structure is used, then the basic protection function is provided, but warpage issues and thermal expansion mismatches occur leading to reliability problems
Solution Approach 1:
The patent applies parameter changes by modifying the lid structure (adding recesses), adjusting thermal interface material placement, and optimizing molding layer properties to compensate for thermal expansion mismatches and reduce warpage, thereby improving reliability without changing the fundamental package architecture
Solution Approach 2:
The patent employs composite materials through the combination of lid, thermal interface material, molding layer, and underfill layer, where each material is selected and positioned to counteract thermal expansion differences and mechanical stress, reducing warpage while maintaining reliability
2Temperature
If the lid is made flat and in direct contact with the semiconductor device, then the structure is simple, but gaps occur between the lid and device leading to poor thermal contact
Solution Approach 1:
The patent applies local quality by creating recesses in specific locations on the lid surface where thermal contact is needed, rather than making the entire lid complex. The recesses are strategically positioned to accommodate thermal interface material and ensure intimate contact with the semiconductor device, improving heat dissipation with minimal added complexity
Solution Approach 2:
The patent uses preliminary action by pre-forming recesses in the lid structure before final assembly, and by pre-positioning thermal interface material in these recesses. This preliminary preparation ensures optimal thermal contact is achieved during assembly without requiring complex post-assembly adjustments or procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation and reliability by ensuring better thermal interface material contact and reducing warpage, thereby enhancing the overall performance and longevity of the semiconductor package.
Implementation Method 1
a thermal interface material disposed between the lid and the semiconductor device
Implementation Method 2
thermal expansion mismatches between components
Data Source
AI summary
A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a semiconductor device, a lid, and a thermal interface material. The interposer substrate is disposed on the carrier substrate. The semiconductor device is disposed on the interposer substrate. The lid is disposed on the carrier substrate to cover the semiconductor device. The thermal interface material is disposed between the lid and the semiconductor device. A first recess is formed on a lower surface of the lid facing the semiconductor device, and the first recess overlaps the semiconductor device in a top view.