Semiconductor Package Lid Support for Heat Dissipation and Stress Relief

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current semiconductor package designs with direct heat dissipation structures induce significant stress and reliability issues due to the force applied, leading to warpage and potential damage.

Innovation Solution

A modified lid structure is introduced to support the heat dissipation structure, reducing stress on the semiconductor package and controlling warpage by using a thermal interface material and a heat dissipation structure with a protruding portion that fills into an opening in the lid, providing enhanced support and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a direct heat dissipation structure is attached to the semiconductor package, then heat dissipation effectiveness is improved, but stress and force on the package increase causing warpage and reliability issues

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidpackage reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

A lid structure is introduced as an intermediary component between the heat dissipation structure and the semiconductor package. The lid includes a supporting part that extends to cover a region of the package, distributing the mechanical stress and force from the heat dissipation structure across a larger area. This mediator prevents direct concentration of force on the package, thereby reducing warpage and improving reliability while maintaining effective heat dissipation through the thermal interface material and heat dissipation structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If a heat dissipation structure is attached directly to the semiconductor package, then heat dissipation is enhanced, but warpage of the package increases

Engineering Contradiction:

Improveheat dissipationVSAvoidpackage warpage

Core Design Contradiction:

TemperatureVSShape

Solution Approach 1:

The lid structure serves as a mediator that decouples the heat dissipation function from the mechanical support function. The supporting part of the lid provides mechanical reinforcement to the package, distributing thermal and mechanical loads evenly. This prevents localized stress concentration that would cause warpage, while the thermal interface material and heat dissipation structure maintain effective thermal coupling for heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If force is applied directly to the semiconductor package for heat dissipation, then heat dissipation performance is improved, but stress on the package increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidpackage stress

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The lid structure with its supporting part acts as a stress-distributing intermediary. When the heat dissipation structure applies force, the lid's supporting part spreads this force across a broader region of the package, reducing peak stress concentrations. This allows effective heat dissipation to be maintained while keeping stress levels within safe limits for the package and its components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively alleviates stress on the semiconductor package, controls warpage, and enhances the reliability of the package structure while maintaining effective heat dissipation.

Implementation Method 1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11756854B2Package structure and method of fabricating the same

Publication Date: 2023.09.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.