Semiconductor Lid Channel Structure for TIM Confinement
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device design with a substrate and cover structure that includes a channel structure for thermal interface material (TIM) to enhance adhesion and prevent TIM from encroaching on other components, using techniques like stamping and etching for manufacturing the lid structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but adhesion strength and reliability are insufficient
Solution Approach 1:
The lid structure is segmented into multiple functional regions: a body portion providing structural support, and channel structures providing thermal pathways. This segmentation allows the TIM to be confined to specific channels, improving adhesion and thermal transfer while maintaining manufacturing feasibility through modular design
Solution Approach 2:
The channel structures are pre-formed in the lid before TIM application. This preliminary action confines the TIM to specific pathways, ensuring proper adhesion and preventing encroachment on electronic components before the encapsulation process begins
2Reliability
If TIM is applied without channel structures, then manufacturing is easier, but TIM encroaches on electronic components causing electrical shorts
Solution Approach 1:
The lid is divided into functional zones using channel structures that segment the TIM application area. This segmentation creates distinct pathways that guide TIM away from electronic components, preventing electrical shorts while maintaining a manageable structural design
Solution Approach 2:
The channel structures act as intermediary elements between the TIM and electronic components. These channels provide a controlled interface that allows thermal transfer while physically preventing TIM from reaching sensitive electronic areas, thus mediating the conflict between thermal management and electrical isolation
3Volume of moving object
If package size is reduced for efficiency, then space utilization improves, but manufacturing precision requirements increase
Solution Approach 1:
The channel structures are pre-formed with precise dimensions and locations before TIM application. This preliminary precision work confines the TIM to specific pathways, allowing for compact package design while maintaining controlled TIM placement through the pre-defined channel geometry
Solution Approach 2:
The channel structures provide localized precision features within the lid structure. By concentrating manufacturing precision requirements in the channel formation process rather than in TIM application, the design enables compact packaging while maintaining reliable TIM confinement through locally optimized structural features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves adhesion strength and reliability by accommodating TIM flow, reducing the risk of electrical shorts and enhancing the overall performance and size efficiency of semiconductor packages.
Implementation Method 1
The channel structure is in the upper cover wall extending inward from the upper wall inner surface... A thermal interface material (TIM) is coupled to the upper wall inner surface and the first electronic component. A portion of the TIM is within the channel structure.
Data Source
AI summary
In one example, an electronic device includes a substrate and a cover structure. The cover structure includes an upper cover wall comprising an upper wall outer surface and an upper wall inner surface opposite to the upper wall outer surface, cover sidewalls extending from the upper wall inner surface and coupled to the substrate. The upper cover wall and the cover sidewalls define a cavity. A channel structure is in the upper cover wall extending inward from the upper wall inner surface. A first electronic component is coupled to the substrate within the cavity and a thermal interface material (TIM) is coupled to the upper wall inner surface and the first electronic component. A portion of the TIM is within the channel structure. Other examples and related methods are also disclosed herein.