Semiconductor Package Lid Window Structure for Die-Lid Gap Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor packaging, achieving compact and reliable packaging of semiconductor dies of different dimensions on a circuit board is challenging due to the difficulty in accurately measuring and managing the gap between the semiconductor die and the lid, which affects the electrical connection and protection of the die.
Innovation Solution
A semiconductor package design featuring a lid with a window opening and a protrusion portion at its bottom, allowing for precise measurement of the gap between the semiconductor die and the lid using optical devices, and optionally incorporating sealant components for protection and contamination prevention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lid is disposed over a semiconductor die to provide protection and electrical connection, then reliability is improved, but the gap between the lid and die becomes difficult to measure and manage accurately
Solution Approach 1:
A gap measurement structure is introduced as an intermediary element between the lid and the semiconductor die. This structure includes a first portion extending from the lid and a second portion extending from the die, with a measurable gap between them. The intermediary structure provides dedicated measurement surfaces that enable accurate gap measurement without interfering with the protective and electrical connection functions of the lid.
Solution Approach 2:
The gap measurement structure is segmented into distinct portions: a first portion associated with the lid and a second portion associated with the die. This segmentation allows each portion to be independently positioned and measured, facilitating accurate gap control while maintaining the overall reliability function of the lid structure.
2Volume of moving object
If compact packaging is pursued to accommodate various semiconductor dies, then space utilization is improved, but manufacturing precision becomes more challenging
Solution Approach 1:
The gap measurement structure serves as a mediator that enables precise gap control in compact packaging. By providing dedicated measurement surfaces and structures, it allows for accurate gap verification even when the overall package size is reduced, thus supporting both compactness and manufacturing precision.
Solution Approach 2:
The gap measurement structure is configured to enable preliminary verification of gap dimensions before final packaging completion. This preliminary measurement action allows for adjustments to be made early in the manufacturing process, ensuring precision is achieved before the compact packaging is finalized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement and management of the gap between the semiconductor die and the lid, enhancing the reliability and compactness of the packaging while ensuring effective electrical connection and protection against contamination.
Implementation Method 1
The first window opening is configured to receive a light of an incident direction, and the incident direction is at an angle to the upper surface of the protrusion portion, so that the light hitting on the upper surface of the protrusion portion is reflected
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a circuit board, a semiconductor die disposed on the circuit board, a support structure disposed on the circuit board and surrounding the semiconductor die, and a lid disposed over the semiconductor die and on the support structure. The lid has a window opening penetrating through the lid and exposing at least a portion of the semiconductor die. The window opening is configured to receive a light of an incident direction, and the incident direction is at an angle to the upper surface of the protrusion portion, so that the light hitting on the upper surface of the protrusion portion is reflected.