Semiconductor Light-Emitting Device With Transparent Adhesive Layer
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Solution Overview
Problem
Conventional semiconductor light-emitting devices for vehicle headlights face challenges in forming a favorable horizontal cut-off line for low beams without a shade, particularly due to deformation of the wavelength converting layer and the resulting curvature or concave-convex surfaces, which affect the linearity and contrast of the cut-off line, and require a reflecting member with a low viscosity that can interrupt light emission and reduce beam flux.
Innovation Solution
The semiconductor light-emitting device includes a base board with conductor patterns, semiconductor light-emitting chips, a wavelength converting layer with phosphors in a transparent resin, a transparent plate aligned with the wavelength converting layer, and a diffusing reflection member between the frame and the wavelength converting layer, with a transparent adhesive layer to prevent deformation and ensure alignment, allowing for a projector type headlight with improved light distribution patterns without a shade.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a reflecting member with low viscosity is used to cover the side surface of the wavelength converting layer, then the horizontal cut-off line can be formed, but the beam flux is reduced and light emission is interrupted
Solution Approach 1:
A transparent adhesive layer is introduced as an intermediary between the wavelength converting layer and the reflecting member. This adhesive layer prevents the reflecting member from directly contacting and interrupting light emission while still allowing the reflecting member to form the horizontal cut-off line by covering the side surface of the wavelength converting layer.
Solution Approach 2:
The viscosity parameter of the reflecting member is specifically controlled to be low (low viscosity) to enable it to flow and cover the side surface of the wavelength converting layer effectively, forming a precise horizontal cut-off line while minimizing interference with light emission.
2Ease of manufacture
If the wavelength converting layer is formed by conventional methods, then the device can be manufactured, but deformation occurs creating curved or concave-convex surfaces that reduce linearity of the cut-off line
Solution Approach 1:
The transparent adhesive layer is applied beforehand to the wavelength converting layer before the reflecting member is added. This adhesive layer acts as a cushioning layer that prevents deformation of the wavelength converting layer during the formation process, thereby maintaining a flat surface and ensuring the linearity of the horizontal cut-off line.
Solution Approach 2:
The transparent adhesive layer functions as a thin film that conforms to the surface of the wavelength converting layer while preventing deformation. This thin film structure allows the wavelength converting layer to maintain its shape and provides a flat surface for the reflecting member to form a precise horizontal cut-off line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the linearity and contrast of the horizontal cut-off line for low beams, improves light emission efficiency, and maintains manufacturing reliability using similar machines to conventional devices, providing a semiconductor light-emitting device suitable for vehicle headlights with high-performance light distribution.
Implementation Method 1
a wavelength converting layer 5 including at least one phosphor in a transparent resin and disposed around the at least one semiconductor light-emitting chip
Implementation Method 2
a diffusing reflection member between the frame and both side surfaces of the wavelength converting layer and the transparent plate
Data Source
AI summary
A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer encapsulating at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, the wavelength converting layer formed around the chip, a transparent plate located on the wavelength converting layer and a diffusing reflection member disposed between the frame and both side surfaces of the wavelength converting layer and the transparent plate. The device can be configured to improve the linearity of a boundary between the diffusing reflection member and both side surfaces by using the transparent plate, and therefore can be used for a headlight that can form a favorable horizontal cut-off line corresponding to the boundary via a projector lens without a shade.