Semiconductor Light Emitting Device Coarse Surface Resin Wet-Spreading
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Solution Overview
Problem
Semiconductor light emitting devices face reduced light emission efficiency due to the covering member climbing up and wet-spreading on the coarse surface of the light emitting surface, and susceptibility to humidity-induced degradation and light leakage, particularly at high temperature and humidity conditions.
Innovation Solution
A semiconductor light emitting device with a wavelength conversion layer and a light reflection member, where a thin film with a coarse surface and a contact angle greater than the wavelength conversion layer is applied to prevent the covering member from climbing and wet-spreading, and a damp-proof film is used to cover the boundary between the wavelength conversion layer and the light reflection member to suppress moisture ingress and crack generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the surface layer of the light emitting surface is made coarse to prevent light reflection and improve light emission efficiency, then light emission efficiency is improved, but the covering member climbs up and wet-spreads on the coarse surface during manufacturing, reducing the surface area of the light emitting surface
Solution Approach 1:
A release agent is applied as an intermediary substance between the light emitting surface and the covering member (resin). The release agent prevents the resin from directly contacting and wet-spreading on the coarse surface, while allowing the light to pass through. This mediator resolves the contradiction by enabling the coarse surface structure to be maintained without suffering from the resin climbing problem.
Solution Approach 2:
The surface properties of the light emitting surface are modified by changing the contact angle through application of a release agent. By adjusting the surface energy parameters, the surface becomes more hydrophobic to the resin material, preventing capillary action and wet-spreading while maintaining the coarse structure for light emission efficiency.
2Temperature
If the covering member is used at high temperature and high humidity for a long period of time, then the device operates in harsh conditions, but a crack may be generated near the boundary between the covering member and the wavelength conversion member, causing light leakage
Solution Approach 1:
The patent applies a damp-proof film and release agent beforehand to create protective barriers that cushion against the harmful effects of high temperature and humidity. These pre-applied protective layers prevent moisture ingress and reduce thermal stress concentration at the boundary, preventing crack formation before it occurs during harsh operation.
Solution Approach 2:
The patent uses thin film layers (damp-proof film and release agent) that are relatively simple and can be reapplied or replaced if needed. These sacrificial protective layers prevent damage to the more critical structural components by absorbing the environmental stress.
3Loss of energy
If the surface layer of the light emitting surface is made coarse to prevent light reflection, then light emission efficiency is improved, but capillary phenomenon occurs on the coarse surface and resin easily wet-spreads, reducing the surface area
Solution Approach 1:
The release agent serves as a manufacturing intermediary that temporarily modifies the surface properties during the manufacturing process. It prevents the resin from interacting directly with the coarse surface structure, eliminating capillary action issues while allowing the desired coarse surface to be formed and maintained.
Solution Approach 2:
The surface energy parameters are temporarily changed during manufacturing by applying the release agent. This parameter modification prevents wet-spreading during the resin application process, making the manufacturing process controllable while maintaining the coarse surface structure needed for light emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light emission efficiency by maintaining the coarse surface of the light emitting surface, prevents light leakage, and improves long-term reliability by reducing the occurrence of cracks and moisture transmission, thereby maintaining brightness and stability.
Implementation Method 1
capillary phenomenon occurs on the coarse surface of the surface layer of the light emitting surface and resin easily wet-spreads on the coarse surface
Implementation Method 2
when corners of the surface layer of the light emitting surface are rounded, the resin is not easily stemmed due to reduction in the surface tension and the resin easily wet-spreads on the surface layer of the light emitting surface
Implementation Method 3
suppress the transmission of damp air through the thin film
Implementation Method 4
a wavelength conversion layer for converting light emitted from the light emitting element to light having a predetermined wavelength
Implementation Method 5
a light reflection member covering at least side surfaces of the wavelength conversion layer
Data Source
AI summary
To improve light emission efficiency and suppress color unevenness on a light emitting surface. Provided is a semiconductor light emitting device including a light emitting element, a wavelength conversion layer for converting light emitted from the light emitting element to light having a predetermined wavelength, a light reflection member covering at least the side surfaces of the wavelength conversion layer, and a thin film provided on the outermost surface from which the light wavelength-converted by the wavelength conversion layer exits, having a property for shedding the uncured light reflection member, and having a coarse surface.