Semiconductor Light Emitting Device with Segmented Conductive Pillars
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Solution Overview
Problem
Current semiconductor light emitting devices face challenges in reliability, particularly in heat dissipation and mountability, due to limitations in the design of terminals and the integration of wavelength conversion layers, which affect the efficiency and consistency of light emission.
Innovation Solution
The semiconductor light emitting device incorporates a light emitting unit with conductive pillars and a sealing unit that includes a wavelength conversion layer, along with terminals designed to enhance heat dissipation and mountability, featuring a specific structure that allows for improved insulation and thermal conductivity, and a manufacturing method that involves forming a resin film and wavelength conversion layer to optimize light extraction and chromaticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional terminal designs are used in semiconductor light emitting devices, then manufacturing is simpler, but heat dissipation is insufficient leading to reduced reliability
Solution Approach 1:
The terminal structure is segmented into multiple functional regions: a mounting portion for electrical connection, a heat dissipation portion with extended surface area, and an insulation portion. This segmentation allows each part to optimize its specific function while collectively improving overall device reliability without excessive complexity
Solution Approach 2:
The terminal extends in multiple spatial dimensions beyond simple planar contacts. The heat dissipation portion projects laterally from the mounting portion, creating a three-dimensional structure that increases surface area for thermal management while maintaining electrical connectivity in the vertical dimension
2Productivity
If wavelength conversion layer is integrated into the sealing unit, then light extraction efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The wavelength conversion layer is merged with the sealing unit to form an integrated component. The conversion layer is positioned within the sealing unit's cavity, allowing the sealing structure to simultaneously provide mechanical protection, optical wavelength conversion, and structural support, thereby improving light extraction efficiency while managing manufacturing complexity through functional integration
3Reliability
If conductive pillars are used to connect light emitting unit to terminals, then electrical connection is improved, but heat dissipation path is limited
Solution Approach 1:
The conductive pillars serve multiple functions simultaneously: they provide electrical connection between the light emitting unit and terminals, act as thermal conduction paths for heat dissipation, and serve as structural support elements. This multi-functionality addresses both electrical connection reliability and heat dissipation requirements through a single integrated component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the semiconductor light emitting device by improving heat dissipation, reducing the risk of damage from heat, and ensuring uniform chromaticity and efficiency in light emission, thereby addressing the limitations of existing devices.
Implementation Method 1
combining an LED that emits blue light and a phosphor that absorbs blue light and emits yellow light
Implementation Method 2
a phosphor that absorbs blue light and emits yellow light
Implementation Method 3
terminals designed to enhance heat dissipation and mountability, featuring a specific structure that allows for improved insulation and thermal conductivity
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3C
AI summary
A semiconductor light emitting device (110, 120, 130) includes a light emitting unit (15), a first and second conductive pillar (41, 42), a sealing unit (44), and a first and second terminal (51, 52). The light emitting unit (15) includes a first and second semiconductor layer (10, 20) and a light emitting layer (30). The light emitting layer (30) is provided on the first semiconductor layer (10). The second semiconductor layer (20) is provided on the light emitting layer (30). The first conductive pillar (41) is provided on the first semiconductor layer (10). The second conductive pillar (42) is provided on the second semiconductor layer (20). The sealing unit (44) covers side faces (15s, 41s, 42s) of each of the light emitting unit (15), the first conductive pillar (41), and the second conductive pillar (42). The first terminal (51) is provided on the first conductive pillar (41) and on the sealing unit (44). The second terminal (52) is provided on the second conductive pillar (42) and on the sealing unit (44).