Semiconductor Light-Emitting Device Heat Sink Segmentation
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Solution Overview
Problem
Conventional can-type semiconductor light-emitting devices face challenges in heat radiation efficiency when attached to heat sinks, which hinders miniaturization and high-density integration, and existing solutions compromise on hermetic sealing and cost-effectiveness.
Innovation Solution
A semiconductor light-emitting device design featuring a metal heat sink with a larger area than the base, incorporating a sheet metal base, an optically transparent cap, a waveguide, an optical path bending member, and leads that pass through a gap between the base and heat sink, allowing for improved heat conduction and hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor light-emitting element is attached to the heat sink with direct contact, then heat radiation performance is improved, but the leads cannot be properly connected and hermetic sealing is compromised
Solution Approach 1:
The patent divides the base into two functional regions: a first region that contacts the heat sink for thermal management, and a second region that is separated from the heat sink to accommodate lead connections and maintain hermetic sealing. This spatial segmentation resolves the contradiction by allowing each region to fulfill its specific function without interference from the other.
Solution Approach 2:
The patent applies different thermal properties to different regions of the base. The first region has high thermal conductivity to efficiently conduct heat to the heat sink, while the second region is thermally isolated to protect the lead connections and internal components. This local differentiation of thermal properties enables simultaneous heat radiation performance and hermetic sealing.
2Temperature
If the base area is increased to improve heat conduction, then thermal resistance is reduced, but device size increases and integration density decreases
Solution Approach 1:
The base is segmented into a heat conduction region and a lead connection region, allowing the heat conduction area to be optimized for thermal performance while the overall device area is constrained by the compact arrangement of both regions. This enables reduced thermal resistance without proportional increase in device size.
Solution Approach 2:
The patent utilizes the thickness dimension of the base to improve heat conduction path efficiency. By optimizing the thermal conduction path through the base thickness and using high thermal conductivity materials in the first region, the patent achieves reduced thermal resistance without requiring a larger planar area, thus maintaining compact device dimensions.
3Reliability
If the lead is positioned to pass through the base for electrical connection, then electrical connectivity is achieved, but heat radiation pathway is blocked and thermal performance deteriorates
Solution Approach 1:
The patent positions the lead to pass through the second region of the base, which is thermally isolated from the heat sink. This spatial segmentation ensures that the lead's presence does not block the primary heat radiation pathway through the first region, maintaining both electrical connectivity and thermal performance.
Solution Approach 2:
The second region of the base acts as a thermal intermediary or barrier between the lead connection area and the heat sink. This intermediary region allows the lead to pass through for electrical connection while preventing thermal interference, thus protecting the heat radiation pathway in the first region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal resistance and light output while maintaining hermetic sealing and cost-effectiveness, enabling higher power light sources with improved miniaturization and integration density.
Implementation Method 1
a heat sink made of metal and a semiconductor light-emitting element, mounted on the heat sink... This design enhances thermal resistance and light output
Implementation Method 2
an optical path bending member that converts an optical path of an emitted beam from a waveguide edge of the semiconductor light-emitting chip into an upward optical path
Data Source
AI summary
A semiconductor light-emitting device 10 includes a heat sink and a semiconductor light-emitting element mounted on the heat sink. A gap is provided between a region of a part of a base bottom surface of a base of the semiconductor light-emitting element and an upper surface of the heat sink, and a lead is disposed in a region where the gap is provided so as to vertically pass through the base. A semiconductor laser chip is provided in a region where the gap is not provided so that its waveguide longitudinal direction is substantially parallel to an upper surface of the base. The lead has its lower end located within the gap and connected to a flexible substrate.