Semiconductor Light-Emitting Device With Segmented Channels
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Solution Overview
Problem
Semiconductor light-emitting diodes (LEDs) face issues with internal quantum efficiency and heat dissipation, leading to reduced reliability and brightness due to ineffective light extraction and heat accumulation.
Innovation Solution
A semiconductor light-emitting device structure featuring a thinned substrate with semiconductor layers and channels, including first channels formed by laser irradiation and second channels with a dielectric and conductive layer, designed to enhance light extraction and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED structure is used, then manufacturing is simple, but light extraction efficiency is low and heat dissipation is poor
Solution Approach 1:
The patent divides the semiconductor layer into multiple segments by forming channels (first channels and second channels) that penetrate through the semiconductor layers. This segmentation creates multiple light extraction paths and thermal conduction pathways, improving both light extraction efficiency and heat dissipation while maintaining a relatively simple manufacturing process using conventional lithography and etching techniques.
Solution Approach 2:
The patent introduces a porous channel structure through the semiconductor layers. These channels act as porous pathways that enable efficient light extraction by reducing total internal reflection and provide thermal conduction channels for heat dissipation. The channel structure is formed using standard semiconductor fabrication processes, balancing structural effectiveness with manufacturing simplicity.
2Reliability
If channels are added to improve light extraction and heat dissipation, then reliability improves, but device complexity increases
Solution Approach 1:
The device is segmented into functional regions with different channel types: first channels for light extraction and second channels for heat dissipation. This segmentation allows each channel type to be optimized for its specific function while using the same basic fabrication approach, improving reliability without proportionally increasing complexity.
Solution Approach 2:
The channel structure serves multiple functions simultaneously: the first channels provide light extraction paths, the second channels provide thermal conduction pathways, and both channel types contribute to reducing total internal reflection. This multi-functionality improves device reliability while avoiding the need for separate independent structures for each function.
3Illumination intensity
If substrate is thinned to improve light extraction, then light extractive efficiency improves, but mechanical strength decreases
Solution Approach 1:
Instead of uniformly thinning the entire substrate, the patent selectively removes material to form channels only in specific regions where light extraction is needed. This segmented approach maintains the mechanical integrity of the bulk substrate while creating localized light extraction pathways, thus improving light extraction efficiency without significantly compromising overall substrate strength.
Solution Approach 2:
The substrate structure is modified locally at channel positions to enable light extraction, while the rest of the substrate maintains its original thickness and mechanical properties. This local modification approach ensures that the substrate retains sufficient mechanical strength for device handling and operation while achieving improved light extraction at critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light extractive efficiency and thermal resistivity, increasing the brightness and reliability of the semiconductor light-emitting device by effectively dissipating heat and extracting light.
Implementation Method 1
the plurality of first channels is formed by a laser irradiating the plurality of first channels
Implementation Method 2
designed to enhance light extraction and thermal conductivity
Data Source
AI summary
This application provides a semiconductor light-emitting device and the manufacturing method thereof. The semiconductor light-emitting device comprises a semiconductor light-emitting structure and a thinned substrate. The semiconductor light-emitting structure comprises a plurality of semiconductor layers and a plurality of first channels, wherein a plurality of first channels has a predetermined depth that penetrating at least two layers of the plurality of semiconductor layers.