Semiconductor Light Emitting Device with Integrated Substrate Connections
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Solution Overview
Problem
The complexity and susceptibility to short-circuiting of electrical connections in multi-cell semiconductor light emitting devices, particularly in high-rated current applications, pose challenges in achieving reliable and efficient light emission.
Innovation Solution
A semiconductor light emitting device design featuring a semiconductor stack with a first and second conductivity type semiconductor layer and an active layer, an insulating layer with defined contact regions, a connection electrode for inter-cell electrical connection, and a transparent support substrate with a bonding layer, allowing for efficient light emission from both surfaces and improved bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple LED chips are electrically connected to a single substrate using wires or metal wiring, then high rated current capability is achieved, but the electrical connection becomes complicated and susceptible to short-circuiting
Solution Approach 1:
The patent merges the electrical connection function into the substrate itself by forming conductive patterns directly on the substrate surface. Multiple LED chips are connected through these integrated conductive patterns rather than external wires, simplifying the overall electrical connection structure while maintaining high current capability
Solution Approach 2:
The substrate acts as an intermediary that provides both mechanical support and electrical connection functions. Conductive patterns formed on the substrate serve as intermediate connection elements that eliminate the need for separate wiring, reducing complexity and short-circuit risk
2Power
If multiple LED chips are electrically connected using wires or metal wiring, then high rated current capability is achieved, but the susceptibility to short-circuiting increases
Solution Approach 1:
By combining the electrical connection function into the substrate through conductive patterns, the patent eliminates multiple separate wiring connections that could potentially short-circuit. The integrated approach reduces the number of connection points and potential failure modes while maintaining high current capability
Solution Approach 2:
The patent extracts the electrical connection function from separate wiring components and integrates it into the substrate structure. This separation of functions (mechanical support and electrical connection) into a single integrated substrate improves reliability by reducing the complexity of external connections
3Power
If light emitting cells are arranged in a multi-cell structure, then high rated current capability is achieved, but the electrical connection becomes complicated
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support for the LED chips, acts as an electrical connection medium through conductive patterns, and facilitates heat dissipation. This multi-functionality simplifies the overall device structure while enabling high rated current operation
Solution Approach 2:
The patent transitions from three-dimensional wiring connections to two-dimensional conductive patterns on the substrate surface. This dimensional change simplifies the electrical connection structure by eliminating the need for complex spatial routing of wires while maintaining connectivity between multiple LED chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables stable and efficient light emission from both surfaces of the semiconductor light emitting device, enhancing reliability and reducing the risk of short-circuits while facilitating various lighting applications.
Implementation Method 1
a transparent bonding layer disposed between the insulating layer and the transparent support substrate
Implementation Method 2
a connection electrode disposed on the insulating layer and connecting the first contact region and the second contact region to electrically connect the plurality of light emitting cells to each other
Implementation Method 3
a semiconductor stack having a first surface and a second surface located opposite each other, including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer and an active layer disposed therebetween
Data Source
AI summary
A semiconductor light emitting device includes a plurality of light emitting cells including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first and second conductivity type semiconductor layers, an insulating layer on the plurality of light emitting cells and having a first opening and a second opening defining a first contact region of the first conductivity type semiconductor layer and a second contact region of the second conductivity type semiconductor layer, respectively, in each of the plurality of light emitting cells, a connection electrode on the insulating layer and connecting the first contact region and the second contact region to electrically connect the plurality of light emitting cells to each other, a transparent support substrate on the insulating layer and the connection electrode, and a transparent bonding layer between the insulating layer and the transparent support substrate.