Semiconductor Light Emitting Device Size Reduction via Substrate Recess
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Solution Overview
Problem
Existing semiconductor light emitting devices, such as the Can-type semiconductor package, face challenges in size reduction due to their bulky design, which limits their miniaturization and increases costs.
Innovation Solution
A semiconductor light emitting device configuration where the semiconductor light emitting element and the holding member are disposed on a substrate, with the wavelength conversion element held by the holding member, allowing for size reduction and a low-profile configuration by eliminating the need for a cylindrical cap and enabling better heat dissipation through a gap between the wavelength conversion element and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Can-type semiconductor package with a cylindrical cap is used to seal the semiconductor laser and hold the wavelength conversion element, then the device is well-sealed and structured, but the device size becomes large and miniaturization is difficult
Solution Approach 1:
The invention extracts and eliminates the cylindrical cap from the traditional Can-type package structure. Instead of using a cap to seal and hold components, the patent uses a substrate with a recess that directly receives and secures the semiconductor light emitting element and wavelength conversion element, removing the unnecessary cap component and reducing overall device size.
Solution Approach 2:
The invention transitions from a three-dimensional cylindrical cap structure to a planar substrate-based mounting structure. The recess in the substrate provides the necessary containment and positioning functions in a two-dimensional plane, eliminating the need for vertical height occupied by a cap and achieving miniaturization.
2Stability of the object's composition
If the wavelength conversion element is held in an opening of a cap, then the structure is stable, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention merges the functions of the cap (holding and positioning) with the substrate. The substrate's recess simultaneously provides mechanical support, positioning, and retention for the wavelength conversion element, eliminating the need for a separate cap structure and simplifying the manufacturing process.
Solution Approach 2:
The invention segments the substrate into a flat mounting surface with an integrated recess, separating the light emission function from the structural containment function. This allows the semiconductor light emitting element to be mounted on the substrate while the recess provides stable holding of the wavelength conversion element without requiring additional components.
3Reliability
If the semiconductor light emitting element is mounted on a columnar base and sealed by a cylindrical cap, then the device is well-protected, but the device complexity and cost increase
Solution Approach 1:
The invention extracts and removes the cylindrical cap and columnar base structure, replacing them with a simple substrate and recess configuration. This eliminates unnecessary structural components while maintaining the essential functions of mounting, positioning, and protecting the semiconductor light emitting element.
Solution Approach 2:
Instead of mounting the semiconductor element on a columnar base and then covering it with a cap (bottom-up approach), the invention uses a substrate with a recess that inherently provides the protective enclosure (top-down approach). The recess structure itself provides the protection previously requiring separate cap and base components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves size reduction and cost-effectiveness by allowing for a more compact design and improved heat management, enhancing the overall performance and reliability of the semiconductor light emitting device.
Implementation Method 1
a wavelength conversion element disposed on light emitting side of the semiconductor light emitting element, that absorbs a portion of the light emitted from the semiconductor light emitting element
Implementation Method 2
that emits light having a wavelength different from that of the absorbed light
Data Source
AI summary
A semiconductor light emitting device includes a substrate a semiconductor light emitting element that is disposed on the substrate and that emits light along a direction substantially parallel to a main surface of the substrate a wavelength conversion element that is disposed on a light emitting side of the semiconductor light emitting element, that absorbs a portion of the light emitted from the semiconductor light emitting element, and that emits light having a wavelength different from that of the absorbed light; and a holding member that is disposed on the substrate and holds the wavelength conversion element.