Semiconductor Light Emitting Device Electrode Segmentation
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Solution Overview
Problem
Semiconductor light emitting devices face challenges in current distribution efficiency, delamination defects between electrodes and semiconductor layers, and limited light output due to inefficient heat radiation and high operating voltage.
Innovation Solution
A semiconductor light emitting device design featuring a first and second conductive semiconductor layer, internal electrodes, and an insulating part with open regions to expose the electrodes, improving current distribution and reducing delamination, along with a manufacturing method that forms grooves and fills them with electrode and insulating materials to enhance light output and heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrode structures are used in semiconductor light emitting devices, then manufacturing is simpler, but current distribution efficiency deteriorates and delamination defects occur
Solution Approach 1:
The first internal electrode is divided into multiple separate electrodes disposed on the second portion of the first conductive semiconductor layer. This segmentation improves current distribution efficiency by creating multiple current injection paths, reducing current crowding effects, and minimizing delamination defects through distributed stress relief.
Solution Approach 2:
The insulating part with open regions serves as an intermediary structure that supports the internal electrodes while allowing current flow through the exposed portions. This mediator enables proper electrical connection between internal and external electrodes while providing mechanical support and insulation where needed.
2Temperature
If conventional insulating structures are used, then manufacturing is easier, but heat radiation efficiency deteriorates
Solution Approach 1:
The insulating part is designed with spatially varying properties: it provides full insulation in covered regions while having open regions that expose internal electrodes for heat dissipation and electrical connection. This local differentiation allows the structure to simultaneously provide thermal management and electrical insulation functions.
3Illumination intensity
If electrodes are fully covered by insulating material, then electrical isolation is improved, but light output and heat radiation deteriorate
Solution Approach 1:
The insulating part is segmented into covered regions and open regions, creating a patterned structure that balances electrical isolation with light extraction and heat dissipation. The open regions allow light to escape and heat to radiate while the covered regions provide necessary electrical insulation.
Solution Approach 2:
Different regions of the insulating part have different functional qualities: covered regions provide electrical isolation while open regions enable light output and thermal management. This local quality differentiation resolves the contradiction between insulation and light/heat performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved current distribution efficiency, reduced delamination defects, lower operating voltage, and enhanced light output and heat radiation efficiency, resulting in a more reliable semiconductor light emitting device.
Implementation Method 1
A light emitting diode (LED) is a semiconductor light emitting device able to emit light of various colors due to the recombination of electrons and electron holes at a junction between p-type and n-type semiconductor layers when current is applied thereto
Implementation Method 2
a first conductive semiconductor layer; an active layer disposed on a first portion of the first conductive semiconductor layer
Data Source
AI summary
A semiconductor light emitting device includes a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first internal electrode, a second internal electrode, an insulating part, and first and second pad electrodes. The active layer is disposed on a first portion of the first conductive semiconductor layer, and has the second conductive layer disposed thereon. The first internal electrode is disposed on a second portion of the first conductive semiconductor layer separate from the first portion. The second internal electrode is disposed on the second conductive semiconductor layer. The insulating part is disposed between the first and second internal electrodes, and the first and second pad electrodes are disposed on the insulating part to connect to a respective one of the first and second internal electrodes.