Semiconductor Light Emitting Element Electrode Opening Geometry
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Solution Overview
Problem
In semiconductor light emitting elements, the FC (flip-chip bonding) mount technology faces challenges with workability and heat release due to small bonding pad areas, which can lead to inadequate light extraction efficiency and thermal management.
Innovation Solution
The semiconductor light emitting element features a laminated structure with a first electrode and a second electrode, where the first opening is arc-shaped to maintain a consistent distance from the second opening's edge, and the second electrode has branch portions along the substrate's edge, enhancing electrical connection and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the bonding pad area is made small to improve light extraction efficiency, then light extraction efficiency is improved, but workability and heat release become insufficient
Solution Approach 1:
The first electrode is divided into a main body portion and a protruding portion that extends toward the second electrode. This segmentation allows the bonding pad area to be increased through the protruding portion while maintaining a compact overall structure, thereby improving workability and heat release without sacrificing light extraction efficiency.
Solution Approach 2:
The electrode structure extends in multiple dimensions: the first electrode has a protruding portion that extends in one direction, and the second electrode has a recessed portion that extends in another direction. This multi-dimensional arrangement increases the effective bonding pad area while maintaining a compact footprint, resolving the contradiction between small area for light extraction and sufficient area for workability.
2Loss of energy
If the bonding pad area is made small to improve light extraction efficiency, then light extraction efficiency is improved, but heat release becomes insufficient
Solution Approach 1:
The first electrode is divided into a main body portion and a protruding portion that extends toward the second electrode. This segmentation allows the bonding pad area to be increased through the protruding portion while maintaining a compact overall structure, thereby improving workability and heat release without sacrificing light extraction efficiency.
Solution Approach 2:
The electrode structure extends in multiple dimensions: the first electrode has a protruding portion that extends in one direction, and the second electrode has a recessed portion that extends in another direction. This multi-dimensional arrangement increases the effective bonding pad area while maintaining a compact footprint, resolving the contradiction between small area for light extraction and sufficient area for workability.
3Area of stationary object
If the electrode openings are arranged closely to reduce device area, then mounting density is improved, but current distribution uniformity deteriorates
Solution Approach 1:
The first electrode has a protruding portion with specific local geometry that extends toward the second electrode, creating localized current distribution optimization. The arc-shaped configuration of the protruding portion ensures uniform current density in the bonding pad area while maintaining close spacing between electrodes, thus improving mounting density without sacrificing current distribution uniformity.
Solution Approach 2:
The protruding portion of the first electrode and the recessed portion of the second electrode feature arc-shaped configurations. This curvature design helps distribute current uniformly across the bonding pad area by avoiding sharp corners and concentration points, enabling close electrode spacing while maintaining current distribution uniformity.
Data Source
AI summary
Disclosed is a semiconductor light emitting element (1) which is provided with: a laminated semiconductor layer which is formed on a substrate, and in which a first semiconductor layer having a first conductivity type, a light emitting layer, and a second semiconductor layer having a second conductivity type different from the first conductivity type; a first electrode (first electrode (170)) which is formed on a surface of the first semiconductor layer in the laminated semiconductor layer, and has a first opening (170a) used for electrical connection with an outside; and a second electrode (second electrode (180)) which is formed on a surface of the second semiconductor layer, and has a second opening (180a) used for electrical connection with the outside. The surface of the second semiconductor layer is exposed by cutting off a part of the laminated semiconductor layer. The first opening (170a) has, on the second opening (180a) side of the first opening (170a) in a planar view, an arc portion which is formed to keep approximately equal distance from an outer edge portion of the second opening (180). With such a semiconductor light emitting element, workability and heat dissipation effects in the FC (flip-chip bonding) mounting technology of the semiconductor light emitting element are improved.