Semiconductor Light Emitting Element Insulating Portion Peeling Prevention
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Solution Overview
Problem
Semiconductor light-emitting elements face instability due to peeling of conductive layers during manufacturing, leading to electrical shorts and reduced reliability.
Innovation Solution
A semiconductor light-emitting element design featuring a base body, semiconductor layers, and a conductive layer with a specific insulating portion configuration, where the insulating portion has varying thicknesses and positions to minimize exposure and peeling of the conductive layer, ensuring stable operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive layer is provided between the base body and the semiconductor layer, then electrical connection is achieved, but peeling occurs during manufacturing causing instability
Solution Approach 1:
An insulating portion is introduced as an intermediary element between the conductive layer and the semiconductor layer. This insulating portion prevents direct contact and potential peeling between the conductive layer and semiconductor layer, while still allowing the conductive layer to maintain electrical connection with the base body. The insulating portion acts as a mediator that resolves the bonding strength issue without compromising electrical functionality.
Solution Approach 2:
The structure is segmented by dividing the interface between the conductive layer and semiconductor layer through the introduction of the insulating portion. This segmentation separates the electrical connection function (conductive layer to base body) from the structural support function (semiconductor layer to base body), allowing each component to optimize its specific function without suffering from peeling issues.
2Reliability
If the insulating portion thickness is increased to prevent peeling, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The insulating portion is strategically positioned only where needed - specifically where the conductive layer and semiconductor layer would otherwise contact each other. The thickness and presence of the insulating portion varies locally rather than being uniform throughout, providing protection exactly where peeling risk exists while minimizing overall structural complexity and manufacturing steps.
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3E
AI summary
According to one embodiment, a semiconductor light-emitting element includes a base body, first to third semiconductor layers, a first conductive portion, and a first insulating portion. The base body has a first surface including an outer edge region and an inner region. The second semiconductor layer is provided between the inner region and the first semiconductor layer. The third semiconductor layer is provided between the first and second semiconductor layers. A portion of the first conductive portion is provided between the base body and the second semiconductor layer. The first insulating portion overlaps the outer edge region in a first direction being from the second semiconductor layer toward the first semiconductor layer. A thickness of the first insulating portion at a position overlapping the base body side surface in the first direction is thicker than a thickness of the first insulating portion at a position separated from the base body side surface in a direction intersecting the first direction.