Semiconductor Light-Emitting Element Mounting with Optical Feedback
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Solution Overview
Problem
Existing semiconductor light-emitting element mounting techniques lack reliability, as they either only evaluate properties before mounting or after, leading to potential damage and defects due to inadequate joining control, resulting in inefficient processes and material loss.
Innovation Solution
A method and apparatus that supply power to the semiconductor light-emitting element to emit light during the mounting process, detect optical properties in real-time, and control the joining process based on these properties using a pressing mechanism and ultrasonic waves to ensure stable and reliable attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If open-loop control is used for mounting, then the mounting process is simple, but joining energy may be applied excessively or insufficiently causing cracks and defects
Solution Approach 1:
The patent implements feedback control by detecting optical properties (luminance, chromaticity) of the light-emitting element during the mounting process and using this information to adjust and control the joining process. This closed-loop approach ensures optimal joining conditions while preventing both excessive and insufficient joining energy application, thereby resolving the contradiction between process simplicity and joining reliability.
2Productivity
If evaluation is performed only before mounting, then the mounting process is fast, but defective elements cannot be identified after mounting
Solution Approach 1:
The patent performs preliminary evaluation of optical properties before mounting to identify defective elements, and simultaneously implements in-process monitoring during mounting. This dual approach allows for both rapid processing and reliable verification, as defective elements are identified and removed before being permanently mounted, while ongoing monitoring ensures mounting quality.
Solution Approach 2:
The system continuously monitors optical properties during the mounting process and uses this feedback to verify element quality. This real-time detection ensures that only elements meeting optical specifications are successfully mounted, maintaining both productivity and reliability.
3Productivity
If evaluation is performed only after mounting, then the mounting process is fast, but replacement is required for defective elements causing losses
Solution Approach 1:
The patent performs preliminary optical property evaluation before the mounting process completes, allowing identification of defective elements while they are still easily removable. This prevents the need for costly and time-consuming replacements after permanent mounting, thereby reducing material loss while maintaining fast processing speed.
4Ease of manufacture
If joining energy is applied continuously, then the mounting process is simple, but cracks and damage may occur after joining is already completed
Solution Approach 1:
The patent uses real-time detection of optical properties during the joining process to provide feedback on joining status. This information is used to dynamically adjust the joining energy application, ensuring precise control that prevents both insufficient joining and excessive energy application that could cause cracks or damage. This maintains manufacturing simplicity while achieving high joining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stable and reliable joining of the semiconductor light-emitting element to the mounting board, preventing defects and ensuring higher reliability and efficiency in the mounting process.
Implementation Method 1
supplying power to the electrode portion of a mounting board to allow a semiconductor light-emitting element to emit light
Implementation Method 2
a pressing mechanism for pressing the retained semiconductor light-emitting element
Implementation Method 3
controlling the joining with ultrasonic waves
Data Source
AI summary
When bump electrodes 26 of a semiconductor light-emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light-emitting element 2 to emit light, the optical properties of the semiconductor light-emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light-emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.