Semiconductor Light Emitting Element Sidewall Reflection Design
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Solution Overview
Problem
Existing semiconductor light emitting elements face challenges in enhancing light diffusion rates, which affects their efficiency and application in display and lighting systems.
Innovation Solution
A semiconductor light emitting element design featuring a flip-type chip with a wavelength conversion layer, sidewall reflection part, and a bottom surface reflection part that directs light output, where the sidewall and bottom surface reflection parts are strategically positioned to improve light diffusion by refracting and reflecting light effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a conventional light emitting element chip structure is used, then the structure is simple and easy to manufacture, but the light diffusion rate is insufficient
Solution Approach 1:
The reflection structure is segmented into two distinct parts: a sidewall reflection part formed on the side surface of the chip, and a bottom surface reflection part formed on the bottom surface. This segmentation allows each part to independently contribute to light diffusion in different directions, thereby improving overall light diffusion rate while maintaining a relatively simple manufacturing process that can be integrated into existing chip fabrication techniques.
Solution Approach 2:
The invention transitions from a conventional single-surface reflection structure to a multi-dimensional reflection system by adding both sidewall and bottom surface reflection parts. This dimensional expansion enables light to be reflected and diffused in multiple spatial directions (sideways and downward), significantly enhancing the light diffusion rate beyond what a single-surface structure could achieve.
2Loss of energy
If the sidewall reflection part is positioned close to the side surface, then the light reflection efficiency is high, but the space for wavelength conversion layer is reduced
Solution Approach 1:
The sidewall reflection part is positioned at a specific optimal distance from the side surface, creating a localized reflection zone. This local positioning strategy ensures that the reflection part is close enough to achieve high light reflection efficiency for downward-directed light, while simultaneously maintaining sufficient space between the reflection part and the side surface to accommodate the wavelength conversion layer with adequate thickness for effective wavelength conversion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly enhances light diffusion and output, improving the efficiency and visibility of display modules while reducing manufacturing costs.
Implementation Method 1
the sidewall reflection part and the bottom surface reflection part are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer
Implementation Method 2
a wavelength conversion layer formed on the upper surface and the side surface of the light emitting element chip
Data Source
AI summary
Disclosed herein are a semiconductor light emitting element and a backlight assembly including the same. The semiconductor light emitting element includes: a light emitting element chip including a first pad and a second pad and having an upper surface and a side surface; a wavelength conversion layer famed on the upper surface and the side surface of the light emitting element chip; a sidewall reflection part famed to be spaced apart from the side surface of the light emitting element chip; and a bottom surface reflection part famed to protrude at a lower portion of the sidewall reflection part. The sidewall reflection part and the bottom surface reflection part of the light emitting element are configured to reflect light in a direction in which the light penetrates through an upper surface of the wavelength conversion layer, the light being generated from the light emitting element chip.