Semiconductor Light-Emitting Element Translucent Conductive Layer Dicing
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Solution Overview
Problem
Semiconductor light-emitting elements with an ODR structure face issues during chip formation due to the low adhesion force of the insulating material to the metal layer, leading to exfoliation of the translucent conductive layer from the metal layer during the dicing process.
Innovation Solution
A semiconductor light-emitting element design where the translucent conductive layer's end face is located inwardly of the substrate's end face, and the second metal layer is provided in separated locations to avoid cutting the translucent conductive layers during dicing, ensuring they are not affected by the cutting process and maintaining adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a translucent conductive layer with insulating material (SiO2) is provided between the metal layer and semiconductor layer to achieve high intensity, then light extraction efficiency is improved, but the insulating material separates from the metal layer during dicing due to low adhesion force
Solution Approach 1:
The translucent conductive layer is divided into multiple separate layers rather than a single continuous layer. This segmentation reduces the stress concentration and prevents complete separation during dicing, as the individual segments can move independently without causing full delamination
Solution Approach 2:
The insulating material is selectively removed from specific regions where dicing occurs, creating local variations in adhesion properties. This allows the translucent conductive layer to maintain strong adhesion in functional areas while having reduced adhesion at cut lines, preventing separation during manufacturing
2Reliability
If the translucent conductive layer extends to the end face of the substrate, then light extraction is maximized, but the layer is cut during dicing causing exfoliation
Solution Approach 1:
The insulating material is extracted or removed from the translucent conductive layer at specific locations where dicing will occur. This creates gaps or reduced-adhesion zones that allow the cutting process to proceed without causing the translucent conductive layer to separate from the metal layer
Solution Approach 2:
The insulating material is removed in advance before the dicing process. This preliminary action prepares the structure to withstand the subsequent cutting operation by eliminating the weak points where separation would occur during manufacturing
Data Source
AI summary
A semiconductor light-emitting element includes a substrate, a first metal layer, a second metal layer, a translucent conductive layer, and a semiconductor layer with a light-emitting region. The translucent conductive layer includes an end face intersecting a plane orthogonal to the thickness direction of the substrate. The substrate includes an end face intersecting a plane orthogonal to the thickness direction. The end face of the translucent conductive layer is located inwardly of the end face of the substrate as viewed in the thickness direction.