Semiconductor Light Emitting Device Fluorescent Layer Design
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Solution Overview
Problem
In small-sized semiconductor light emitting devices, the high concentration of fluorescent materials can lead to reduced light extraction efficiency due to obstruction of emission light by fluorescent material particles, affecting the chip size package structure.
Innovation Solution
A semiconductor light emitting device design featuring a fluorescent material layer with a lower layer portion covering the entire surface and an upper layer portion of varying thickness and width, integrated by a bonding material, where transparent regions between the upper layer portions prevent light obstruction, enhancing light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the concentration of fluorescent materials is increased to maintain chip size package structure, then the device size is reduced, but the light extraction efficiency is reduced due to obstruction of emission light by fluorescent material particles
Solution Approach 1:
The fluorescent material layer is segmented into multiple layers with different fluorescent material concentrations and particle size distributions. The lower layer has higher concentration and smaller particles, while the upper layer has lower concentration and larger particles, creating a gradient structure that reduces light obstruction while maintaining compact device size
Solution Approach 2:
Different regions of the fluorescent material layer are assigned different properties: the lower layer portion contains fluorescent materials with smaller particle sizes and higher concentration, while the upper layer portion contains fluorescent materials with larger particle sizes and lower concentration, optimizing light extraction at different depths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves light extraction efficiency while maintaining a chip size package structure by minimizing light obstruction from fluorescent material particles, thereby increasing the output of the semiconductor light emitting device.
Implementation Method 1
a light emitting layer (13)
Implementation Method 2
The fluorescent materials are configured to be excited by radiated light of the light emitting layer and to radiate light of a different wavelength from the radiated light of the light emitting layer
Data Source
AI summary
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode and a fluorescent material layer. The semiconductor layer has a first surface and a second surface on an opposite side to the first surface and includes a light emitting layer. The fluorescent material layer includes a plurality of fluorescent materials and a bonding material integrating the fluorescent materials. The fluorescent material layer includes a lower layer portion provided to spread over the entire first surface and having a larger thickness than a size of the fluorescent materials and an upper layer portion partially provided on the lower layer portion and having a larger thickness and a larger width than a size of the fluorescent materials. The fluorescent materials do not exist on a portion of the lower layer portion not provided with the upper layer portion.