Semiconductor Light Emitting Device Insulating Layer Laser Scribing
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Solution Overview
Problem
Existing semiconductor light emitting devices face challenges in preventing interlayer shorts during the chip separation process, particularly due to debris generated from the conductive support member during laser scribing, which can lead to reliability issues and inefficiencies in the manufacturing process.
Innovation Solution
A semiconductor light emitting device design that includes a light emitting structure with compound semiconductor layers, a conductive support member, and an insulating layer to prevent debris from reaching the outer wall, where the insulating layer is strategically placed between the conductive support member and the light emitting structure to maintain adhesion and prevent shorts, and the conductive layer is made of transparent materials to minimize damage during laser scribing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser scribing is used for chip separation, then chip separation efficiency is improved, but debris is generated from the conductive support member causing interlayer shorts
Solution Approach 1:
An insulating layer is introduced as an intermediary between the conductive support member and the light emitting structure. This insulating layer prevents direct contact between conductive elements, thereby avoiding interlayer shorts caused by debris generated during laser scribing chip separation, while still allowing the laser process to proceed efficiently.
2Strength
If conductive support member is used for structural support, then mechanical strength is improved, but debris generation during laser scribing causes harmful effects
Solution Approach 1:
The insulating layer serves as a protective intermediary that prevents debris from the conductive support member from reaching and causing shorts in the light emitting structure, allowing the conductive support member to maintain its mechanical strength function without generating harmful effects.
Solution Approach 2:
The harmful conductive material is extracted or replaced at the interface where debris generation causes problems. The insulating layer effectively removes the conductive property from the support structure at the critical interface, preventing debris-related shorts while maintaining mechanical support.
3Reliability
If isolation etching process is used to prevent interlayer shorts, then electrical reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The insulating layer is formed in advance during the manufacturing process, before chip separation occurs. This preliminary action ensures that protective insulation is already in place to prevent interlayer shorts, eliminating the need for subsequent isolation etching processes and simplifying the overall manufacturing workflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and efficiency of chip separation by preventing interlayer shorts and simplifying the manufacturing process, ensuring clean side surfaces and improved electrical reliability of the semiconductor light emitting device.
Implementation Method 1
an insulating layer on the conductive layer... the insulating layer is strategically placed between the conductive support member and the light emitting structure to maintain adhesion and prevent shorts
Implementation Method 2
debris generated from the conductive support member during laser scribing... the conductive layer is made of transparent materials to minimize damage during laser scribing
Data Source
AI summary
According to an embodiment of the present invention, a semiconductor light emitting device includes a light emitting structure including a plurality of compound semiconductor layers, an electrode layer disposed under the light emitting structure, an electrode disposed on the light emitting structure, a conductive support member disposed under the electrode layer, a conductive layer disposed between the light emitting structure and the conductive support member, and an insulating layer disposed between the conductive support member and the light emitting structure, wherein the electrode layer is in contact with a first area of a lower surface of the light emitting structure and the conductive layer is in contact with a second area of the lower surface of the light emitting structure, and wherein the conductive layer includes a different material from the electrode layer.