Semiconductor Light-Emitting Module With Heat Isolation
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Solution Overview
Problem
High-power light-emitting diodes face challenges in heat dissipation, particularly in environments with temperature differences, leading to reduced luminous efficiency and shortened service life, as traditional heat-dissipating methods are ineffective in high-temperature settings like automobile headlight applications.
Innovation Solution
A semiconductor light-emitting module incorporating a heat-dissipating member with an isolator and a heat-conducting device, such as a heat pipe, that uses an isolator member to prevent heat dissipation efficiency from being influenced by high environment temperatures, allowing effective heat dissipation through a combination of thermal conductivity and fin structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a heat-dissipating member is disposed in a high-temperature environment (e.g., near automobile engine), then the light-emitting diode can be positioned closer to the vehicle body, but the heat dissipation efficiency decreases due to reduced temperature difference
Solution Approach 1:
The heat-dissipating member is divided into two distinct parts: a first heat-dissipating member disposed in the high-temperature environment near the vehicle body, and a second heat-dissipating member disposed in a lower temperature environment. This segmentation allows each part to operate in its optimal thermal environment while working together to dissipate heat from the light-emitting diode.
Solution Approach 2:
A heat-conducting member is introduced as an intermediary component to connect the light-emitting diode with the heat-dissipating members. This heat-conducting member facilitates efficient heat transfer from the diode to the heat-dissipating structure, bridging the thermal path between the heat source and the dissipation elements in different thermal environments.
2Device complexity
If traditional heat-dissipating methods are used in high-temperature environments, then the structure remains simple, but the junction temperature of the light-emitting diode remains high reducing luminous efficiency and service life
Solution Approach 1:
The heat-dissipating member is divided into two distinct parts: a first heat-dissipating member disposed in the high-temperature environment near the vehicle body, and a second heat-dissipating member disposed in a lower temperature environment. This segmentation allows each part to operate in its optimal thermal environment while working together to dissipate heat from the light-emitting diode.
Solution Approach 2:
The heat dissipation system extends in the thermal gradient dimension by utilizing both high-temperature and low-temperature zones within the vehicle. The first heat-dissipating member operates in the high-temperature zone near the engine, while the second heat-dissipating member extends into a lower temperature zone, creating a thermal path that spans different temperature dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively dissipates heat generated by high-power light-emitting diodes in high-temperature environments, enhancing luminous efficiency and service life while maintaining aesthetic and functional integration with automobile components.
Implementation Method 1
The heat-conducting device can be a heat pipe or other devices with high thermal conductivity efficiency. During the operation of the diode light-emitting device, the generated heat can be conducted via the heat-conducting device to the heat-dissipating member
Implementation Method 2
The heat-dissipating member has an isolator member coupled to a first side of the heat-dissipating member. The heat-dissipating member has a second side opposite to the first side. The isolator member has a third side opposite to the first side. The environment temperature at the third side is higher than that at the second side.
Implementation Method 3
a plurality of fins are formed on the second side of the heat-dissipating member
Data Source
AI summary
The invention provides a semiconductor high-power light-emitting module including a heat-dissipating member, a heat-conducting device, and a diode light-emitting device. The heat-dissipating member includes an isolator member coupled to a first side of the heat-dissipating member. The heat-dissipating member has a second side opposite to the first side. The isolator member has a third side opposite to the first side. The environment temperature at the third side is higher than that at the second side. The heat-conducting device has a flat end and a contact portion tightly mounted on the heat-dissipating member. The diode light-emitting device is disposed on the flat end of the heat-conducting device. The semiconductor light-emitting module of the invention, applied to a headlamp of an automobile, has properties of saving electricity and long life, and furthermore the capability of integrating the heat-dissipating member into a shell of the automobile is both artistic and practical.