Semiconductor Light-Emitting Device Protection Pattern Layer

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor light-emitting devices face challenges in achieving high light extraction efficiency and reliability due to limitations in existing electrode formation processes that can damage semiconductor layers and lead to increased operating voltage.

Innovation Solution

The semiconductor light-emitting device incorporates a protection pattern layer on a limited region of the emission structure, with an insulating pattern layer and electrode layer formed in a way that exposes a portion of the protection pattern layer, preventing material reaction with the semiconductor layer and enhancing light reflectance and extraction efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrode layer is formed directly on semiconductor layer, then electrical connection is achieved, but semiconductor layer is damaged and operating voltage increases

Engineering Contradiction:
Improvesemiconductor layer integrityVSAvoidoperating voltage
Core Design Contradiction:
ReliabilityVSPower

Solution Approach 1:

A protection pattern layer is introduced as an intermediary between the electrode layer and semiconductor layer. This protection pattern layer prevents direct contact between the electrode material and semiconductor layer, avoiding damage and unwanted reactions while still allowing electrical connection through controlled openings. The intermediary layer resolves the contradiction by enabling both electrical connectivity and semiconductor layer protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The protection pattern layer is segmented with openings that selectively expose specific regions of the semiconductor layer. This segmentation allows electrical connection only where needed while protecting other regions, thus reducing operating voltage without compromising semiconductor layer integrity in critical areas.

Inventive Principle:
Principle #1Segmentation

2Reliability

If conventional electrode formation process is used, then electrical connection is established, but light extraction efficiency is reduced

Engineering Contradiction:
Improveelectrical connectionVSAvoidlight extraction efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The protection pattern layer is applied selectively to specific regions rather than uniformly across the entire semiconductor structure. This local application allows areas with high light extraction requirements to remain exposed, while other areas receive protection. The local quality approach enables simultaneous achievement of electrical connection and high light extraction efficiency by optimizing the protection coverage spatially.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the risk of semiconductor layer damage, lowers operating voltage, and improves light extraction efficiency by creating high-reflection regions within the device.

Implementation Method 1

improves light extraction efficiency by creating high-reflection regions within the device

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10121939B2Semiconductor light-emitting devices and methods of manufacturing the same
Publication Date: 2018.11.06 SAMSUNG ELECTRONICS CO LTD
  • US10121939B2 patent drawing
  • US10121939B2 patent drawing
  • US10121939B2 patent drawing

AI summary

A semiconductor light-emitting device may include an emission structure, a protection pattern layer on a limited region of the emission structure, and an insulating pattern layer on the emission structure. The protection pattern layer may expose a separate remaining region of the emission structure, and the first insulating pattern layer may cover at least the remaining region of the emission structure. The insulating layer may include an opening that exposes at least a portion of a surface of the protection pattern layer, such that the emission structure remains covered by at least one of the insulating layer and the protection pattern layer.