Semiconductor Light Emitting Device Transparent Layer Color Uniformity
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Solution Overview
Problem
Semiconductor light emitting devices with chip-size package structures face limitations in light output power and emission color consistency, particularly in achieving uniform light distribution and reducing color breakup.
Innovation Solution
The semiconductor light emitting device incorporates a semiconductor layer with a light emitting layer, a fluorescent substance layer, and a transparent layer made of transparent resin, where the fluorescent substance layer is positioned on top of the semiconductor layer and the transparent layer is interposed between the semiconductor and fluorescent substance layers, along with a metal film that reflects light to enhance light output and reduce color unevenness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a chip-size package structure is used, then device miniaturization is achieved, but light output power and emission color consistency deteriorate
Solution Approach 1:
The device is segmented into distinct functional layers: semiconductor layer, transparent layer, and fluorescent substance layer. This segmentation allows each layer to perform its specific function optimally while maintaining a compact overall structure, resolving the contradiction between miniaturization and light output power.
Solution Approach 2:
The patent transitions from a conventional planar structure to a vertical stacked structure with multiple layers arranged in the thickness direction. This dimensional reorganization increases light extraction efficiency and output power without increasing the planar footprint, thus maintaining device miniaturization.
2Volume of moving object
If a chip-size package structure is used, then device miniaturization is achieved, but emission color consistency deteriorates
Solution Approach 1:
The transparent layer acts as an intermediary between the semiconductor layer and fluorescent substance layer. It controls light transmission and interaction, ensuring uniform excitation of the fluorescent material and consistent emission color across the device area while maintaining compact dimensions.
Solution Approach 2:
Each layer is designed with specific local properties: the transparent layer has optimized refractive index and thickness for uniform light distribution, and the fluorescent substance layer has controlled composition and thickness. These localized quality optimizations ensure consistent emission color throughout the device.
3Illumination intensity
If transparent layer and fluorescent substance layer are added, then light output power and color consistency improve, but device complexity increases
Solution Approach 1:
Multiple functional layers (semiconductor layer, transparent layer, fluorescent substance layer) are merged into a single integrated stacked structure. This consolidation achieves enhanced light output and color consistency while maintaining a compact form factor, balancing performance improvement with structural simplicity.
Solution Approach 2:
The transparent layer serves multiple functions simultaneously: it acts as an optical waveguide, a structural support, and a interface for light extraction. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light output power by minimizing light absorption and enhances emission color consistency by suppressing color breakup and color unevenness, resulting in a more efficient and uniform light emission.
Implementation Method 1
the transparent layer transmitting the light emitted from the light emitting layer
Implementation Method 2
includes a fluorescent substance radiating light different in a wavelength from light emitted from the light emitting layer
Implementation Method 3
a metal film that reflects light to enhance light output and reduce color unevenness
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A semiconductor light emitting device (1-9;10;11) includes a semiconductor layer (15), a p-side interconnect portion (41), an n-side interconnect portion (43), a fluorescent substance layer (30) and a transparent layer (70,170,270;370). The semiconductor layer (15) has a first major surface (15a), a second major surface (15b), and a first side surface, the semiconductor layer (15) including a light emitting layer (13). The p-side and n-side interconnect portions (41,43) are electrically connected to the semiconductor layer (15). The fluorescent substance layer (30) is provided on the first major surface side. The transparent layer (70,170,270;370) is provided between the semiconductor layer (15) and the fluorescent substance layer (30), and has a second side surface. The semiconductor light emitting device (1-9;10;11) further includes an insulating film (18) covering the first side surface and the second side surface, and a reflecting member covering the first side surface and the second side surface via the insulating film (18).