Semiconductor Light-Emitting Device Wavelength Conversion Layer
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Solution Overview
Problem
Conventional semiconductor light-emitting devices with small light-emitting surfaces struggle to efficiently utilize light emitted from both the top and side surfaces of the semiconductor light-emitting chip, resulting in reduced light-emitting efficiency and non-uniform color tone.
Innovation Solution
The semiconductor light-emitting device incorporates a transparent material layer with a tabular shape and a wavelength converting layer that surrounds the side surface of the chip, combined with a reflective material layer, to direct and mix light from both surfaces, enhancing light-emitting efficiency and achieving a uniform color tone.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a small light-emitting surface is used, then the optical structure can be minimized and the device can be miniaturized, but light from the side surface cannot be efficiently utilized
Solution Approach 1:
The patent extends the wavelength converting layer from the top surface to the side surface of the semiconductor light-emitting chip, utilizing the vertical dimension to capture light emitted from multiple surfaces. This dimensional extension allows the device to collect light from both top and side emissions without increasing the horizontal footprint, thus maintaining miniaturization while improving light utilization efficiency.
Solution Approach 2:
The wavelength converting layer is positioned to surround the semiconductor light-emitting chip, with the layer nested around the chip's side surface. This nested configuration allows the converting layer to capture side-emitted light while the chip remains centrally positioned, effectively utilizing space without increasing overall device volume.
2Device complexity
If light from side surface is not utilized, then the structure remains simple, but color tone uniformity deteriorates
Solution Approach 1:
The wavelength converting layer is divided into distinct regions: a first region on the top surface and a second region on the side surface. This segmentation allows each region to be optimized for its specific function while working together to produce uniform color output. The separated regions can have different phosphor compositions tailored to capture and convert light from their respective surfaces.
Solution Approach 2:
Different portions of the wavelength converting layer are assigned different phosphor materials or concentrations based on their location. The first wavelength converting region on the top surface and the second wavelength converting region on the side surface can have locally optimized properties to ensure that light converted from both surfaces contributes equally to the overall color output, achieving uniform color tone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high light-emitting intensity and uniform color tone from a small light-emitting surface, effectively utilizing light from both the top and side surfaces of the semiconductor chip, improving overall efficiency and color consistency.
Implementation Method 1
a wavelength converting layer being disposed between a bottom surface of the transparent material layer and a side surface of the semiconductor light-emitting chip... being able to wavelength-convert light emitted from the semiconductor light-emitting chip 20
Implementation Method 2
a reflective material layer 60... disposed between the frame 50 and side surfaces 30c, 40c of the wavelength converting layer 30 and the transparent material layer 40
Data Source
AI summary
A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a color variation by using the surrounding portion and an inclined side surface of transparent material layer, and therefore can emit various colored lights including white light having a high light-emitting efficiency from a small light-emitting surface.