Semiconductor Light-Receiving Area Sealing with Spacer Projections
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Solution Overview
Problem
Existing semiconductor devices face challenges in miniaturization due to the size of translucent lids and the adhesion process, which can lead to damage from dust and void formation during the dicing process, and require high pressure for bonding, making it difficult to maintain a consistent gap and prevent adhesive crushing.
Innovation Solution
A semiconductor device with a spacer bonded to the chip via a first adhesive and a transparent substrate bonded to the spacer via a second adhesive, featuring projections to maintain position and prevent adhesive crushing, along with a black spacer for noise reduction, and a manufacturing method that applies adhesives in a fluid state to avoid voids and high pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a translucent lid is used to hermetically seal the cavity, then moisture and dust protection is improved, but the planar size of the device increases, restricting miniaturization
Solution Approach 1:
The patent divides the sealing function into two separate components: a transparent plate that seals only the light-receiving area, and a frame that provides the structural boundary. This segmentation allows the transparent plate to be smaller than the full device footprint, enabling miniaturization while maintaining protection of the critical light-receiving area.
Solution Approach 2:
The patent applies adhesive to the outer peripheral portion of the light-receiving area before mounting the transparent plate. This preliminary adhesive application ensures that the transparent plate is securely bonded in advance, creating a hermetic seal that protects the light-receiving area from moisture and dust without requiring a larger overall structure.
2Productivity
If dicing is performed to divide the semiconductor wafer, then discrete devices are produced, but chipping and dust adhere to the light-receiving area, damaging the surface
Solution Approach 1:
The patent applies adhesive and mounts the transparent plate to seal the light-receiving area before the dicing process is performed. This preliminary sealing action protects the light-receiving area from chipping and dust during subsequent dicing operations, ensuring surface integrity while still allowing discrete device production.
Solution Approach 2:
The adhesive layer applied around the light-receiving area acts as a cushioning protective barrier before the dicing process. This beforehand protection prevents direct contact between the dicing saw and the vulnerable light-receiving area, reducing the risk of chipping and dust adhesion.
3Strength
If high pressure is applied during bonding, then adhesive bonding strength is improved, but the gap between the transparent plate and light-receiving area becomes inconsistent and adhesive is crushed
Solution Approach 1:
The patent applies adhesive only to the outer peripheral portion of the light-receiving area, concentrating the adhesive in a specific location where it is needed for sealing. This local quality approach allows bonding without requiring high pressure that would crush the adhesive or create inconsistent gaps, as the adhesive is strategically placed at the periphery rather than uniformly across the entire area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables miniaturization without high-pressure application, suppresses void formation, maintains a consistent gap, and reduces noise by controlling temperature and light reflection, while ensuring reliable bonding and heat dissipation.
Implementation Method 1
an adhesive layer 109 is formed on an outer peripheral portion of a light-receiving area 104A of a solid-state imager device 104, and a transparent plate 108, e.g., a glass plate, is disposed above the solid-state imager device to seal the light-receiving area by firm bonding with the adhesive layer
Implementation Method 2
a black spacer for noise reduction
Data Source
AI summary
A semiconductor device which includes a semiconductor chip formed with a light-reception area, a spacer, and a transparent substrate. The spacer is bonded to the semiconductor chip via a first adhesive and surrounding the light-reception area. The transparent substrate is bonded to the spacer via a second adhesive and disposed above the light-reception area. A first projection having a predetermined height is formed on a surface of the spacer which is on a side of the semiconductor chip, and the first projection abuts on the semiconductor chip.