Semiconductor Light-Emitting Device with Reflective Aluminum Carrier
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Solution Overview
Problem
Existing semiconductor lighting devices face challenges with light coupling due to substrate reflectivity issues, leading to contamination, light losses, and poor wetting of surface regions, especially with silicone-based reflective materials, which can creep onto electrical components.
Innovation Solution
A semiconductor lighting device with a substrate coated in a highly reflective aluminum carrier, coated in a reflection-intensifying manner, such as MIRO or MIRO SILVER, which is applied over a large area without cutouts, allowing for improved light reflection and protection against environmental influences, and can be used with or without insulating layers, enabling efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If silicone with reflective filling material is used to cover the substrate, then light reflection is improved, but contamination of emission surfaces and light losses occur
Solution Approach 1:
The patent introduces an intermediary substance (release agent or release paper) between the silicone reflective material and the LED emission surfaces. This intermediary layer prevents direct contact and contamination while still allowing the silicone to provide its reflective function, thus resolving the contradiction between improving light reflection and preventing contamination.
Solution Approach 2:
The patent segments the substrate surface into different functional zones: areas covered with silicone for light reflection, and areas kept free of silicone for LED mounting and emission. This segmentation allows the reflective silicone to be applied without contaminating the emission surfaces, as the LED chips are mounted on the uncovered substrate regions.
2Illumination intensity
If silicone is applied to cover the substrate, then light reflection is improved, but silicone creeps up on walls and electrical lines onto the emitter area
Solution Approach 1:
The release agent or release paper acts as a barrier that prevents silicone from creeping up on vertical surfaces such as LED walls and electrical bonding wires. This intermediary layer controls the silicone flow and keeps it confined to the intended substrate areas, eliminating the creeping problem while maintaining reflective coverage.
Solution Approach 2:
The release agent is applied in advance to specific areas where silicone creeping would be problematic (such as around electrical lines and LED walls). This preliminary protective measure prevents the harmful creeping action before it occurs, allowing the silicone to be applied freely without damaging electrical components.
3Illumination intensity
If large-area silver layer is used as light-reflecting layer, then light reflection is improved, but protection against corrosion and migration is required
Solution Approach 1:
The patent uses a composite structure consisting of a silver reflective layer combined with a protective coating layer. The silver provides high light reflection, while the outer protective layer shields it from corrosion and migration. This composite material approach allows the system to simultaneously achieve both high reflectivity and long-term reliability without requiring separate protection measures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances luminous efficiency by minimizing light losses and preventing contamination, allowing for reliable and efficient light emission from semiconductor light sources, including LEDs, with improved protection against corrosion and easy application.
Implementation Method 1
at least one reflective surface region of the substrate is covered with a light-reflecting layer, and wherein the light-reflecting layer has an aluminum carrier coated in a reflection-intensifying manner
Data Source
AI summary
A semiconductor lighting device may include a substrate populated with at least one semiconductor light source, wherein at least one reflective surface region of the substrate is covered with a light-reflecting layer, and wherein the light-reflecting layer has an aluminum carrier coated in a reflection-intensifying manner.