Semiconductor Treatment Liquid for Cu/Co Anticorrosion and Residue Cleaning
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Solution Overview
Problem
Existing semiconductor treatment liquids cannot simultaneously achieve excellent anticorrosion properties against Cu and Co and effective cleanability for organic residues on treated surfaces.
Innovation Solution
A semiconductor treatment liquid comprising a purine compound and an amine compound, where the purine compound includes at least one selected from the group consisting of purine and a purine derivative, and the amine compound includes a tertiary amine compound and one or two more amine compounds different from the tertiary amine compound, with a specific mass ratio of purine compound to amine compound.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a treatment liquid containing quaternary ammonium hydroxide compounds and organic amine compounds is used, then the pH can be adjusted to 10-14 for removing contaminants, but the liquid cannot simultaneously achieve both anticorrosion properties against Cu and Co and cleanability for organic residues
Solution Approach 1:
The patent changes the chemical composition parameters of the treatment liquid by introducing a specific purine compound (such as 2,6-diaminopurine) in combination with organic amine compounds. This parameter change enables the liquid to simultaneously achieve pH adjustment (10-14), anticorrosion properties against Cu and Co, and cleanability for organic residues, resolving the contradiction between these opposing requirements
Solution Approach 2:
The patent creates a composite treatment liquid system combining purine compounds with specific organic amine compounds (such as triethanolamine, diethylenetriamine, or triisopropanolamine). This composite formulation synergistically provides both metal anticorrosion protection and effective organic residue removal capabilities that neither component could achieve alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The treatment liquid achieves excellent anticorrosion properties against Cu and Co while maintaining effective cleanability for organic residues, enhancing the semiconductor manufacturing process.
Implementation Method 1
a purine compound; and an amine compound, in which the purine compound includes at least one selected from the group consisting of purine and a purine derivative
Implementation Method 2
a method of etching or removing foreign substances on a surface of the substrate using a treatment liquid which dissolves a metal and/or an organic substance
Data Source
AI summary
An object of the present invention is to provide a semiconductor treatment liquid which has excellent anticorrosion properties against at least one metal selected from the group consisting of Cu and Co in a case of being brought into contact with an object containing the metal, and also has excellent cleanability for organic residues on a surface of the object to be treated; and to provide a treatment method for an object to be treated and a manufacturing method of an electronic device. The treatment liquid of the present invention contains a purine compound and an amine compound, in which the purine compound includes at least one selected from the group consisting of purine and a purine derivative, the amine compound includes at least two of one amine compound A and one or two or more amine compounds B different from the amine compound A, the amine compound A is a tertiary amine compound, and a mass ratio of a content of the purine compound to a content of the amine compound is 0.0001 to 0.1.