Semiconductor Liquid Supply Flow Control for Stable Solute Concentration
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Solution Overview
Problem
Existing devices for supplying liquid for semiconductor manufacturing struggle to precisely regulate solute concentration and maintain stable flow rates, especially when the number of single wafer cleaning devices in operation fluctuates.
Innovation Solution
A device comprising a supply pipe, a preparation unit for creating liquid with predetermined concentration, and a concentration control unit, with a flow-regulating mechanism in the drain pipe to adjust flow rates and maintain concentration stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a one-time type device for supplying liquid for semiconductor manufacturing is used to prepare and supply cleaning solution according to the amount used at the point of use, then the device can supply liquid on demand, but the capability to follow concentration fluctuations in flow rate is not very high
Solution Approach 1:
The patent introduces a feedback control mechanism where a flow meter measures the actual flow rate of the cleaning solution, and this measured value is fed back to a control unit. The control unit adjusts the opening degree of a flow control valve based on the difference between the target flow rate and the measured flow rate, thereby maintaining stable concentration despite flow rate fluctuations.
Solution Approach 2:
The patent replaces simple mechanical flow control with an automated control system that uses a flow meter for measurement and a control unit for decision-making. This substitution of mechanical systems with instrumented control systems enables precise flow rate regulation and stable concentration maintenance.
2Reliability
If feedback control method using flow meter and water quality meter is used to cope with flow rate fluctuations, then the control capability is improved, but the capability to follow concentration fluctuations in flow rate is still limited
Solution Approach 1:
The patent implements a closed-loop feedback control system where the flow meter continuously monitors the actual flow rate, and the control unit dynamically adjusts the flow control valve to maintain the target flow rate. This real-time feedback mechanism enables precise concentration control by compensating for flow rate variations.
Solution Approach 2:
The patent employs dynamic control where the flow control valve's opening degree is continuously adjusted based on real-time flow rate measurements. This dynamic adjustment capability allows the system to respond to and compensate for flow rate fluctuations, maintaining stable concentration throughout the process.
3Speed
If proportional control method using flow meter is used, then the control response is improved, but the capability to meet strict concentration control required by semiconductor industry is still limited
Solution Approach 1:
The patent utilizes feedback control where the actual flow rate measured by the flow meter is continuously compared with the target flow rate. The control unit calculates the error and adjusts the flow control valve accordingly, enabling both rapid response and high precision concentration control required in semiconductor manufacturing.
Solution Approach 2:
The patent replaces simple proportional mechanical control with an automated control system that integrates flow measurement, error calculation, and dynamic valve adjustment. This substitution enables the system to achieve both fast response and the high precision concentration control necessary for semiconductor industry applications.
Data Source
AI summary
A device for supplying liquid for semiconductor manufacturing (1) according to the present invention has a supply pipe (2) communicating with a supply source of ultrapure water (W), a conductivity modifier supply mechanism (3) and an oxidation reduction potential modifier supply mechanism (4) provided midway in this supply pipe (2), a membrane-type deaerator (5), and a particulate removal filter (6). The supply pipe (2) branches into a main pipe (7) and a drain pipe (8). The main pipe (7) is provided with a first instantaneous flow meter (10), and is further in communication with a single wafer-cleaning device (9). The drain pipe (8) is provided with a second instantaneous flow meter (11), and is further provided with a flow-regulating valve (12). A sensor unit (13) is provided between the membrane-type deaerator (5) and the particulate removal filter (6). A control means (15) can control the flow-regulating valve (12).