Semiconductor Load Module Directly Connected to Loadlock Chamber
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses face challenges in reducing footprint and minimizing substrate contamination, which affects production costs and yield.
Innovation Solution
A semiconductor manufacturing apparatus is designed with a multi-chamber structure comprising a load module, loadlock module, transfer module, and process module, featuring a direct connection between the load module and loadlock module to reduce space occupancy, and incorporating purge gas supply systems and transfer robots to prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a multi-chamber structure is used to reduce substrate contamination, then substrate purity is improved, but device footprint area increases
Solution Approach 1:
The load module and loadlock module are directly connected without intermediate chambers, merging two previously separate functional areas into a compact integrated structure. This reduces the overall apparatus footprint while maintaining the distinct atmospheric and vacuum environments needed for substrate contamination prevention.
Solution Approach 2:
The substrate container is nested within the loadlock chamber, which is connected to the load module. This nested arrangement allows multiple functional zones (load port, loadlock chamber, substrate container) to occupy overlapping spatial volumes, reducing the external footprint of the apparatus while preserving internal contamination barriers.
2Area of stationary object
If direct connection between load module and loadlock module is implemented, then apparatus footprint is reduced, but risk of substrate contamination increases
Solution Approach 1:
A door mechanism acts as an intermediary between the load module and loadlock module. The door can seal the connection interface, preventing direct atmospheric contamination from reaching the vacuum environment while allowing substrate transfer. This intermediary element enables direct connection without compromising contamination control.
Solution Approach 2:
The loadlock chamber provides an inert vacuum environment between the atmospheric load module and the process chambers. This vacuum barrier prevents contamination transmission while the direct connection minimizes spatial footprint. The inert environment acts as a protective buffer zone for substrate transfer.
3Object-affected harmful factors
If purge gas supply system is added to prevent contamination, then substrate purity is improved, but device complexity increases
Solution Approach 1:
The purge gas supply function is extracted as a separate, dedicated system with gas supply lines and control mechanisms. This modular extraction allows the purge function to be added without fundamentally redesigning the chamber structure, reducing the complexity increase while maintaining effective contamination prevention.
Solution Approach 2:
The purge gas system serves multiple functions: it prevents contamination during substrate transfer, maintains pressure differentials between chambers, and protects during door operations. This multi-functionality justifies the added complexity by providing several contamination protection mechanisms through a single integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively minimizes footprint and reduces substrate contamination, enhancing production efficiency and yield by ensuring precise and clean processing environments.
Implementation Method 1
the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure
Implementation Method 2
the load module being connected to a purge gas supply for supplying a purge gas into the substrate container
Implementation Method 3
a second transfer robot within the transfer chamber; and a process module including a process chamber connected to the transfer module
Data Source
AI summary
A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.