Semiconductor Package Magnetic Layer Inclined Surface EMI Shielding
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Solution Overview
Problem
Existing semiconductor packages face challenges in enhancing EMI shielding performance while maintaining contact area between magnetic and conductive layers without deforming the magnetic layer, which affects post-processing steps like physical vapor deposition or paste spray.
Innovation Solution
A semiconductor package design that includes a magnetic layer with an inclined surface and polymer layers with specific thickness and adhesion properties, allowing for increased contact area between the magnetic and conductive layers without compromising post-processing integrity, achieved through controlled dicing and adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the contact area between the magnetic layer and the conductive layer is increased to reduce contact resistance and improve EMI shielding performance, then the EMI shielding performance is improved, but the magnetic layer may deform and affect post-processing steps
Solution Approach 1:
The patent applies parameter changes by modifying the physical properties of the polymer layer (specifically its modulus) to enable increased contact area between the magnetic layer and conductive layer. By controlling the polymer layer's modulus to be within a specific range (0.1 to 10 MPa), the magnetic layer can be deformed to increase contact area without causing permanent damage or affecting post-processing steps, thus resolving the contradiction between improving EMI shielding performance and maintaining manufacturing precision
Solution Approach 2:
The patent applies preliminary action by performing the dicing process at a specific stage in the manufacturing sequence - after the magnetic layer is positioned on the polymer layer but before the conductive layer is applied. This timing allows the magnetic layer to be pre-deformed into the desired configuration with increased contact area, ensuring that when the conductive layer is subsequently applied, the magnetic layer maintains its deformed shape for optimal contact without interfering with later processing steps
2Reliability
If the contact area between the magnetic layer and the conductive layer is increased to reduce contact resistance, then the contact resistance is reduced, but the dicing process and polymer layer properties must be precisely controlled to avoid affecting post processes
Solution Approach 1:
The patent applies parameter changes by establishing specific parameter ranges for the polymer layer (modulus: 0.1 to 10 MPa, thickness: 1 to 100 μm) that enable the dicing process to successfully increase contact area without requiring overly complex process control. These parameter specifications provide clear manufacturing guidelines that balance the need for increased contact area with the need to maintain simplicity in the dicing and overall manufacturing process
Data Source
AI summary
A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.