Semiconductor Package Mark Inspection via Binary Image Matching
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Solution Overview
Problem
Current machine vision technologies for inspecting semiconductor package marks are inefficient due to the time and resources required for visual inspection, especially as semiconductor packages become smaller, leading to potential misjudgment and distribution of defective products.
Innovation Solution
A method involving the acquisition of original inspection and reference images, conversion into binary images through thresholding, calculation of area and shape matching rates by comparing error pixels and circularities, and equalization of pixels per inch to determine the defectiveness of semiconductor package marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If visual inspection is used for semiconductor package marks, then inspection can be performed, but it takes a lot of time and resources
Solution Approach 1:
The patent replaces manual visual inspection with an automated machine vision system that captures images of semiconductor packages and uses image processing algorithms to automatically detect and evaluate mark defects, thereby eliminating the time and resource consumption associated with human visual inspection
Solution Approach 2:
The patent transforms the inspection process from subjective visual assessment to objective quantitative evaluation by calculating specific parameters such as area matching rate and shape matching rate, enabling rapid automated decision-making about mark quality without time-consuming human judgment
2Measurement precision
If quantitative evaluation criteria are developed for mark defects, then inspection accuracy improves, but system complexity increases
Solution Approach 1:
The patent divides the complex task of mark defect evaluation into distinct quantitative components: area matching rate calculation and shape matching rate calculation. Each component handles a specific aspect of defect detection, making the overall system more manageable and implementable despite the complexity of achieving high measurement precision
Data Source
AI summary
A method of inspecting a mark of a semiconductor package includes: acquiring an original inspection image and an original reference image to determine whether the mark is defective; acquiring a target reference image and a target inspection image by converting each of the original reference image and the original inspection image into a binary image through thresholding; calculating an area matching rate by calculating a number of error pixels that have different brightness values from each other, among pixels of the target reference image that correspond to pixels of the target inspection image, and by using the number of error pixels relative to a number of total pixels of the target reference image; and calculating a shape matching rate by acquiring a first circularity of the target reference image and a second circularity of the target inspection image, and by comparing the first circularity with the second circularity.