Semiconductor Mark Protection During Dicing
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Solution Overview
Problem
The cutting of semiconductor wafers with dicing blades often results in chipping and cracks, particularly when alignment marks are present, leading to potential defects from marks dropping off and becoming large foreign matters in subsequent processes.
Innovation Solution
A manufacturing method involving the formation of marks with a different material on the semiconductor wafer, followed by covering these marks with a protective or electrode film that extends into the dicing region, preventing the marks from coming off even if cracks occur during dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If marks are applied in the dicing region for alignment purposes, then positioning accuracy is improved, but cracks and chipping occur on the semiconductor substrate during dicing
Solution Approach 1:
A protective film is formed over the marks before the dicing process begins. This preliminary protective action prevents the dicing blade from directly contacting the marks and substrate, thereby avoiding cracks and chipping while maintaining positioning accuracy through the underlying marks
Solution Approach 2:
The protective film acts as an intermediary layer between the dicing blade and the semiconductor substrate with marks. This intermediate layer absorbs the mechanical stress during cutting, preventing direct transmission of force to the substrate and marks, thus avoiding cracks while preserving alignment functionality
2Productivity
If dicing is performed with a dicing blade, then semiconductor devices are separated into individual pieces, but marks may come off the substrate and become large foreign matters
Solution Approach 1:
The protective film is applied to the marks before dicing occurs. This preliminary protection ensures that even if cracks develop in the substrate during the separation process, the marks remain anchored to the substrate through the protective film, preventing them from detaching and becoming foreign matters in subsequent processing
Solution Approach 2:
The protective film provides beforehand cushioning to the marks during the dicing process. It absorbs and distributes the mechanical stress that would otherwise concentrate on the marks and substrate interface, preventing mark detachment and reducing the risk of foreign matter contamination in later stages
Data Source
AI summary
A manufacturing method of a semiconductor device includes: forming a mark on a surface of a semiconductor wafer, at least a part of the mark being disposed in a planned-peripheral region, the planned-peripheral region being located around a respective planned-element region where a semiconductor element is to be formed; forming the semiconductor element in the planned-element region using the mark; forming a film that extends across a range including the planned-element region or the planned-peripheral region in the surface so as to cover at least a part of the mark with the film, after forming the semiconductor element; and after forming the film, cutting the semiconductor wafer along a dicing region, the dicing region located around the planned-peripheral region.