Semiconductor Package Marking Film for Thin Molding Layer
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Solution Overview
Problem
Semiconductor packages face thermal damage during laser marking due to insufficient thickness of the molding layer, which needs to be increased for protection, limiting the use of thinner layers.
Innovation Solution
A semiconductor package with a thermoreactive marking film that reacts to electromagnetic waves, including thermochromic or photochromic materials, and reflectors, allowing for efficient marking while reducing the thickness of the molding layer, and incorporating a reflection layer and reinforcement materials to enhance strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the molding layer thickness is increased to protect the package substrate and semiconductor chip from laser thermal damage, then the protection reliability is improved, but the package size and complexity increase
Solution Approach 1:
The patent divides the protective function into two separate components: the molding layer provides mechanical protection, while the marking film with thermoreactive layer provides laser resistance and marking functionality. This segmentation allows the molding layer to be thin without compromising overall protection reliability.
Solution Approach 2:
The marking film acts as an intermediary layer between the laser and the molding layer. The thermoreactive layer in the marking film absorbs and reacts to laser energy, preventing thermal damage from reaching the molding layer and underlying components, thus enabling thin molding layer design.
2Object-affected harmful factors
If the molding layer thickness is increased to prevent thermal damage, then the thermal protection is improved, but the manufacturing cost and process complexity increase
Solution Approach 1:
The marking film serves as a mediator that intercepts laser energy before it can cause thermal damage to the molding layer. This allows the use of thinner molding layers without increasing overall package complexity.
Solution Approach 2:
The patent uses composite materials in the marking film, combining thermoreactive materials with reflective particles. This composite structure provides both thermal protection and marking functionality in a single thin layer, reducing the need for thicker molding layers.
3Productivity
If a marking film with thermoreactive layer is added to enable efficient marking and reduce molding layer thickness, then the marking efficiency is improved, but the device complexity increases
Solution Approach 1:
The marking film performs multiple functions simultaneously: it provides laser resistance, enables efficient marking through the thermoreactive layer, and can display package information. This multi-functionality justifies the added complexity by eliminating the need for separate protective and marking layers.
Solution Approach 2:
The thermoreactive layer contains composite materials including discoloration materials (thermochromic, photochromic) and reflective particles. This composite composition enables efficient laser marking while maintaining a thin profile that doesn't significantly increase overall package complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient marking processes with a thinner molding layer, reducing thermal damage and warpage, while maintaining protection and aesthetic features like gloss and adjustable color.
Implementation Method 1
the thermoreactive layer may include a discoloration material selected from a group consisting of thermochromic material, photochromic material
Implementation Method 2
the thermoreactive layer may include a discoloration material selected from a group consisting of thermochromic material, photochromic material
Implementation Method 3
the thermoreactive layer may further include reflectors that reflect the electromagnetic wave
Data Source
AI summary
A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.