Semiconductor Package Marking Plate for Clear Barcode Recognition
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Solution Overview
Problem
Existing semiconductor packages face challenges in ensuring clear visibility of marking patterns for identification information, particularly in stacked configurations where the surface roughness and shape differences between marking regions can affect light reflection and recognition accuracy.
Innovation Solution
The semiconductor package incorporates a marking plate with distinct surface roughness and shape differences between regions, including two-dimensional barcodes and symbolic patterns, to enhance visibility and recognition, using a combination of insulating and metal layers with varying surface features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a marking pattern is formed on a flat surface, then the manufacturing process is simple, but the visibility and recognition accuracy of the marking pattern is reduced due to diffused light reflection
Solution Approach 1:
The patent applies local quality by creating different surface roughness characteristics in different marking regions. Specifically, the first marking region has a first surface roughness while the second marking region has a second surface roughness that is different from the first. This allows each region to be optimized for its specific function: one region for high-precision machine recognition and another for human visual inspection, thereby resolving the contradiction between manufacturing simplicity and recognition accuracy.
Solution Approach 2:
The patent changes the surface roughness parameter of the marking plate to improve marking visibility and recognition accuracy. By controlling and varying the surface roughness in different regions (first surface roughness vs. second surface roughness), the patent optimizes light reflection characteristics to enhance both machine readability and human readability without complicating the overall manufacturing process.
2Ease of manufacture
If the same surface roughness is used across all marking regions, then the manufacturing process is simplified, but the visibility and readability for different purposes (machine recognition and human inspection) is compromised
Solution Approach 1:
The patent implements local quality by assigning different surface roughness values to different marking regions based on their intended use. The first marking region (for machine recognition) has a first surface roughness optimized for automated optical character recognition, while the second marking region (for human inspection) has a second surface roughness optimized for visual readability. This regional differentiation maintains ease of manufacture while significantly improving ease of operation for both machine and human users.
3Measurement precision
If marking patterns are made with high contrast and distinct features, then recognition accuracy is improved, but the device complexity increases due to multiple layers and structures
Solution Approach 1:
The patent resolves the contradiction between recognition accuracy and device complexity by applying local quality principles. Instead of making the entire marking plate complex, only specific regions (first and second marking regions) have differentiated surface roughness characteristics. This localized approach achieves high recognition accuracy for different purposes while keeping the overall device structure relatively simple and manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the visibility and readability of marking patterns by minimizing diffused light reflection and ensuring clear identification information, even in stacked configurations, through strategic surface roughness and shape variations.
Implementation Method 1
a surface roughness of the first marking plate is greater than a surface roughness of the second marking plate
Data Source
AI summary
Provided is a semiconductor package including a first wiring structure extending in a first direction and a second crossing the first direction, a first semiconductor chip stacked on the first wiring structure in a third direction different from the first direction and the second direction, a second wiring structure on the first semiconductor chip, the second wiring structure including an insulating layer and a first metal layer on the insulating layer, and a marking plate on the first metal layer, the marking plate including a first marking region and a second marking region different from the first marking region, wherein a shape of the first metal layer corresponding to the first marking region and a shape of the first metal layer corresponding to the second marking region are different from each other, and wherein a shape of an uneven structure in the first marking region and a shape of an uneven structure in the second marking region are different from each other.