Semiconductor Marking Material for Durable Laser Marks and Underfill Flow

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Solution Overview

Problem

Existing methods for marking semiconductor devices without a specific marking layer face challenges in durability and compatibility with thermal processes, requiring new materials that do not disrupt the semiconductor process and withstand reliability tests.

Innovation Solution

A method involving a marking material composed of resin, curing agent, and fillers is used, which is sintered via laser heating to form a cured product that can withstand thermal budgets, allowing marking without affecting the semiconductor process, and the cured product can act as a deflector to control underfill flow during packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If laser radiation is absorbed by the black PM layer to create marks, then production information can be immediately obtained through the two-dimensional barcode, but it causes challenges for packages without specific marking layer and requires new materials that will not impact the whole semiconductor process

Engineering Contradiction:

Improveproduction information retrievalVSAvoidmarking layer structure

Core Design Contradiction:

Loss of informationVSDevice complexity

Solution Approach 1:

The marking material layer is designed to serve multiple functions: it acts as both the marking surface for laser absorption and a functional layer that does not interfere with semiconductor processing. The material composition (resin, curing agent, filler) enables it to withstand thermal budgets and reliability tests while providing the necessary laser absorption characteristics for mark formation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The marking material's properties are optimized through parameter selection - choosing materials with appropriate laser absorption coefficients, thermal stability, and chemical resistance. The filler content and resin type are adjusted to achieve the desired balance between mark formation capability and process compatibility.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If new marking materials are used to withstand thermal budget and reliability tests, then durability is improved, but it may impact the whole semiconductor process

Engineering Contradiction:

Improvemark durabilityVSAvoidcompatibility with semiconductor process

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The marking material layer is formulated with specific local properties - high thermal stability and laser absorption - while maintaining overall compatibility with the semiconductor manufacturing process. The filler and resin combination provides localized durability enhancement without requiring changes to the entire process stack.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The marking material is designed as a consumable layer that can be applied and processed without affecting permanent structures. It serves its purpose during marking and thermal processing, then remains stable throughout the device lifecycle without requiring additional protection or maintenance.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Ease of manufacture

If marking is performed on packages without specific marking layer, then process simplicity is maintained, but marking durability and reliability are compromised

Engineering Contradiction:

Improvemarking process simplicityVSAvoidmark durability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The marking material layer is applied in advance to the package surface before final assembly and testing. This preliminary application ensures that the marking surface is ready for laser processing while the material has already been positioned to withstand subsequent thermal and mechanical processes without requiring rework.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables durable and reliable marking on semiconductor devices without disrupting the manufacturing process, while also addressing uneven underfill flow issues by guiding and controlling the flow rate during packaging.

Implementation Method 1

the marking material is sintered by heat to bond and cure the resin

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

The marking material is sintered to bond and cure the resin

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 3

the cured product can act as a deflector to control underfill flow during packaging

Methodology Applied

Scientific EffectFluid flow guidance: Capillary Action

Data Source

PatentUS12489064B2Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark

Publication Date: 2025.12.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.