Semiconductor Member Coating Vaporization for Solder Void Reduction
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Solution Overview
Problem
Rust-resistant coatings on semiconductor module substrates using benzotriazole-based rust preventives can inhibit solder wettability, generate voids, and lead to corrosion, compromising the mechanical reliability and thermal performance of power semiconductor modules, while their removal increases production costs.
Innovation Solution
A treated coating with a vaporization temperature lower than or equal to the solder's solidus temperature is applied to the substrate surfaces, vaporizing before solder melting to prevent void formation and ensure reliable bonding without increasing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a benzotriazole-based rust preventive is applied to the circuit plate or metal plate surface, then oxidation and corrosion prevention is improved, but solder wettability deteriorates and void formation increases
Solution Approach 1:
The harmful organic halide component is selectively removed from the rust preventive coating through a cleaning process using an alkaline solution, while retaining the beneficial corrosion protection function of the coating
Solution Approach 2:
The rust preventive coating is applied before soldering to prevent corrosion during storage and transport, then subsequently cleaned to remove organic halides before the soldering process to ensure good solder wettability
2Reliability
If a rust-resistant coating is applied to prevent oxidation, then corrosion protection is improved, but the coating vaporizes to generate foams that become voids in the solder
Solution Approach 1:
The organic halide component responsible for foam generation during soldering is removed from the rust preventive coating through alkaline cleaning, while the inorganic corrosion protection function is preserved
Solution Approach 2:
The coating is applied in advance for corrosion protection, then cleaned to remove volatile organic components before soldering to prevent void formation during the soldering process
3Reliability
If cleaning is performed to remove organic halide, then corrosion resistance is improved, but production cost increases
Solution Approach 1:
The cleaning process uses a specifically formulated alkaline solution with controlled concentration and temperature parameters to effectively remove organic halides while being cost-effective and suitable for mass production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The treated coating effectively reduces voids in solder-bonded portions, enhancing the mechanical reliability and thermal performance of power semiconductor modules while maintaining cost-effectiveness by vaporizing before solder melting, thus preventing oxidation and corrosion.
Implementation Method 1
a treated coating covering a surface of the metal portion, the treated coating including a treatment agent, wherein the treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder
Data Source
AI summary
A member for semiconductor device includes a metal portion configured to be bonded to another member by solder, and a treated coating covering a surface of the metal portion, the treated coating including a treatment agent. The treated coating vaporizes at a temperature lower than or equal to a solidus temperature of the solder.